An object of the present invention is to prevent electrical characteristics of circuit elements from being adversely affected by copper diffusion in a semiconductor device having an integrated circuit and an antenna formed over the same substrate, which uses copper plating for the antenna. Another object is to prevent a defect of a semiconductor device due to poor connection between an antenna and an integrated circuit in a semiconductor device having the integrated circuit and the antenna formed over the same substrate. In a semiconductor device having an integrated circuit 100 and an antenna 101 formed over one substrate 102 , when a copper plating layer 108 is used for a conductor of the antenna 101 , it is possible to prevent copper diffusion to circuit elements and decrease an adverse effect on electrical characteristics of circuit elements due to the copper diffusion because a base layer 107 of the antenna 101 uses a nitride film of a predetermined metal. Moreover, by the use of nickel nitride as a metal nitride for the base layer of the antenna, poor connection between the antenna and the integrated circuit can be decreased.

Claims

16 · 4 independent · depth 2

16 granted claims

›1.independentA semiconductor device comprising:nan antenna for communicating information formed over a substrate; andan integrated circuit formed over the substrat…+3

›5.independentA semiconductor device comprising:na first antenna for communicating information formed over a substrate;a second antenna formed over the substrate; a…+3

›9.independentA semiconductor device comprising:nan antenna for communicating information formed over a substrate; andan integrated circuit formed over the substrat…+3

›13.independentA semiconductor device comprising:na first antenna for communicating information formed over a substrate;a second antenna formed over the substrate; a…+3

Classifications

3 codes

IPC · International Patent Classification

Section H — Electricity

H01Q1/38

USPC · US Patent Classification

343/700.MS343/850

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Pendency

1.0 y

361 days filing → grant

Office actions

non-final + final

Responses

1 RCE

Examiner

Hoang V Nguyen

art unit 2821 · TC 2800

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Citations: 9 back · 0 forward

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1 priority documents

›Priority documents — 1

Type	Document	Date
related publication	US 20100270868 A1	28 Oct 2010

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