Terminal and mobile terminal apparatus
Granted 21 Jun 2011 · 2 office actions
Current assignee: Fujitsu Technology Solutions Intellectual Property GmbH · originally Fujitsu Limited
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Inventors: Hidekatsu Kobayashi, Manabu Hongo, Hiroaki Matsuda, Wataru Murata +3 · Examiner: Hung S Bui · AU 2835 · TC 2800
Life of the patent
9 dated eventsAbstract
A terminal is formed by plating a terminal substrate in which a first material capable of being plated and a second material incapable of being plated are two-color molded. For example, by two-color molding an ABD resin and a PC resin to form a terminal substrate and plating the terminal substrate, a terminal having a conductive part corresponding to the ABS resin and a nonconductive part corresponding to the PC resin is obtained.
Claims
3 · 1 independent · depth 2Classifications
5 codes- H04B1/03
- H05K5/02
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1 priority documents›Priority documents — 1
| Type | Document | Date |
|---|---|---|
| related publication | US 20080124626 A1 | 29 May 2008 |
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