Optoelectronic module, and method for the production thereof

An optoelectronic module, comprising: a housing, a carrier element having electrical connection electrodes and electrical lines; at least one semiconductor component for emitting or detecting electromagnetic radiation, said semiconductor component being applied on the carrier element, being electrically connected to connection electrodes of the carrier element and being encapsulated with a casting compound whose outer surface forms a radiation coupling area, wherein the outer surface is remote from the housing; at least one optical device assigned to the semiconductor component; and a connecting layer made of a radiation-transmissive, deformable material arranged in a gap between the radiation coupling area of the semiconductor component and the optical device, the connecting layer being at least partly cured, wherein after the connecting layer is applied, the optical device and the semiconductor component are fixed relative to one another and pressed against one another, thereby squeezing the at least partly cured connecting layer arranged therebetween, wherein the connecting layer contacts both the radiation coupling area of the semiconductor component and the optical device, and wherein the squeezed connecting layer generates an opposing force that strives to press the optical device and the radiation coupling area of the semiconductor component apart.

A method for producing an optoelectronic module comprising the steps of: providing a housing, providing a carrier element having electrical connection electrodes and electrical lines; providing a semiconductor component for emitting or detecting electromagnetic radiation, said semiconductor component being encapsulated with a casting compound whose outer surface forms a radiation coupling area, wherein the outer surface is remote from the housing; providing an optical device; applying the semiconductor component on the carrier element and electrically connecting the semiconductor component to the connection electrodes; mounting the optical device above the radiation coupling area of the semiconductor component; and prior to mounting the optical device, applying a curable and, when in a cured state, a radiation-transmissive and deformable composition at least over the radiation coupling area of the semiconductor component, wherein the applied composition is at least partly cured or let to be cured, and wherein, after the composition is applied, the optical device and the semiconductor component are fixed relative to one another and pressed against one another, thereby squeezing the at least partly cured composition disposed therebetween, wherein the composition contacts both the radiation coupling area of the semiconductor component and the optical device; and wherein the squeezed applied composition, generates an opposing force that strives to press the optical device and the radiation coupling area apart.