A wireless IC device comprising:na wireless IC arranged to transmit and receive signals;a feeder circuit substrate including a feeder circuit incorporating an inductance element connected to the wireless IC in a galvanically conductive state and in which a feeder electrode coupled to the inductance element is provided on a surface of the feeder circuit substrate or an inside of the feeder circuit substrate;a radiation plate that is electromagnetically coupled to the feeder electrode; anda mounting electrode provided on a surface of the feeder circuit substrate; whereinthe mounting electrode is electrically independent from the feeder circuit.
›2.↳ 1The wireless IC device according to claim 1, wherein, between the feeder electrode and the mounting electrode, the mounting electrode is disposed at a…d2
The wireless IC device according to claim 1, wherein, between the feeder electrode and the mounting electrode, the mounting electrode is disposed at an outer edge portion of the feeder circuit substrate.
›3.↳ 1The wireless IC device according to claim 1, wherein the mounting electrode is disposed on a side surface of the feeder circuit substrate.d2+5
The wireless IC device according to claim 1, wherein the mounting electrode is disposed on a side surface of the feeder circuit substrate.
›4.↳ 3The wireless IC device according to claim 3, wherein the mounting electrode is disposed on each of two opposite side surfaces of the feeder circuit su…d3
The wireless IC device according to claim 3, wherein the mounting electrode is disposed on each of two opposite side surfaces of the feeder circuit substrate.
›5.↳ 3The wireless IC device according to claim 3, wherein the mounting electrode is disposed on each of the two opposite side surfaces of the feeder circui…d3
The wireless IC device according to claim 3, wherein the mounting electrode is disposed on each of the two opposite side surfaces of the feeder circuit substrate at line-symmetrical positions.
›6.↳ 3The wireless IC device according to claim 3, wherein the mounting electrode is disposed at a distance spaced away from a lower surface of the feeder c…d3
The wireless IC device according to claim 3, wherein the mounting electrode is disposed at a distance spaced away from a lower surface of the feeder circuit substrate.
›7.↳ 3The wireless IC device according to claim 3, wherein the feeder circuit substrate includes a laminated body in which an insulating material layer and …d3
The wireless IC device according to claim 3, wherein the feeder circuit substrate includes a laminated body in which an insulating material layer and an electrode layer are laminated, and the mounting electrode is arranged so as to expose the electrode layer on at least one of surfaces of the laminated body.
›8.↳ 3The wireless IC device according to claim 3, wherein the feeder circuit substrate includes a laminated body in which an insulating material layer and …d3
The wireless IC device according to claim 3, wherein the feeder circuit substrate includes a laminated body in which an insulating material layer and an electrode layer are laminated, and the mounting electrode is arranged in a recess formed on at least one of side surfaces of the laminated body.
›9.↳ 1The wireless IC device according to claim 1, further comprising a resonant circuit that is provided in the feeder circuit substrate.d2+3
The wireless IC device according to claim 1, further comprising a resonant circuit that is provided in the feeder circuit substrate.
›10.↳ 9The wireless IC device according to claim 9, wherein the resonant circuit or the matching circuit is arranged so that the wireless IC is galvanically …d3
The wireless IC device according to claim 9, wherein the resonant circuit or the matching circuit is arranged so that the wireless IC is galvanically connected to the feeder electrode.
›11.↳ 9The wireless IC device according to claim 9, wherein the resonant circuit or the matching circuit includes an element incorporated in the feeder circu…d3
The wireless IC device according to claim 9, wherein the resonant circuit or the matching circuit includes an element incorporated in the feeder circuit substrate and an element mounted on the feeder circuit substrate.
›12.↳ 9The wireless IC device according to claim 9, wherein the resonant circuit or the matching circuit includes an element provided for the feeder circuit …d3
The wireless IC device according to claim 9, wherein the resonant circuit or the matching circuit includes an element provided for the feeder circuit substrate and an element mounted on a substrate for which the radiation plate is provided.
›13.↳ 1The wireless IC device according to claim 1, further comprising a matching circuit that is provided in the feeder circuit substrate.d2
The wireless IC device according to claim 1, further comprising a matching circuit that is provided in the feeder circuit substrate.
›14.↳ 1The wireless IC device according to claim 1, wherein the radiation plate is provided on at least one of a surface or an inside of a radiation substrat…d2
The wireless IC device according to claim 1, wherein the radiation plate is provided on at least one of a surface or an inside of a radiation substrate.
›15.↳ 1The wireless IC device according to claim 1, further comprising a substrate-side mounted electrode that is provided on a surface of a radiation substr…d2+1
The wireless IC device according to claim 1, further comprising a substrate-side mounted electrode that is provided on a surface of a radiation substrate in which the radiation plate is provided, wherein the substrate-side mounted electrode is electrically connected to the mounting electrode of the feeder circuit substrate.
›16.↳ 15The wireless IC device according to claim 15, wherein the substrate-side mounted electrode is electrically connected to the radiation plate.d3
The wireless IC device according to claim 15, wherein the substrate-side mounted electrode is electrically connected to the radiation plate.
›17.↳ 1The wireless IC device according to claim 1, wherein the feeder electrode is arranged over a range from a surface, facing the radiation plate, of the …d2
The wireless IC device according to claim 1, wherein the feeder electrode is arranged over a range from a surface, facing the radiation plate, of the feeder circuit substrate to at least one of surface of the feeder circuit substrate that does not face the radiation plate.
›18.↳ 1The wireless IC device according to claim 1, wherein a plurality of the radiation plates are provided.d2
The wireless IC device according to claim 1, wherein a plurality of the radiation plates are provided.
›19.↳ 1The wireless IC device according to claim 1, wherein at least one of a plurality of the feeder electrodes or a plurality of the mounting electrodes ar…d2
The wireless IC device according to claim 1, wherein at least one of a plurality of the feeder electrodes or a plurality of the mounting electrodes are provided on a surface of the feeder circuit substrate.
›20.↳ 1The wireless IC device according to claim 1, further comprising a sealing resin that is provided between a radiation substrate, on which the radiation…d2
The wireless IC device according to claim 1, further comprising a sealing resin that is provided between a radiation substrate, on which the radiation plate is provided, and the feeder circuit substrate.
›21.↳ 1The wireless IC device according to claim 1, wherein the feeder circuit includes at least two inductance elements having different inductances.d2
The wireless IC device according to claim 1, wherein the feeder circuit includes at least two inductance elements having different inductances.
›22.↳ 1The wireless IC device according to claim 1, whereinnthe feeder circuit substrate includes the inductance element and a capacitance element at differe…d2
The wireless IC device according to claim 1, whereinnthe feeder circuit substrate includes the inductance element and a capacitance element at different positions in plan view,the capacitance element is electromagnetically coupled to a feeder electrode that is different from the feeder electrode to which the inductance element is electromagnetically coupled, andthe different radiation plates are respectively coupled to the feeder electrodes in a galvanically non-conductive state.
›23.↳ 1The wireless IC device according to claim 1, wherein the feeder circuit substrate is defined by a multilayer substrate.d2
The wireless IC device according to claim 1, wherein the feeder circuit substrate is defined by a multilayer substrate.
›24.↳ 1The wireless IC device according to claim 1, further comprising a protection film arranged to cover at least one of a wireless IC chip arranged to tra…d2
The wireless IC device according to claim 1, further comprising a protection film arranged to cover at least one of a wireless IC chip arranged to transmit and receive signals, the feeder circuit substrate and the radiation plate.
›25.↳ 1The wireless IC device according to claim 1, wherein an imaginary portion of an input/output impedance of the wireless IC device conjugates with the i…d2
The wireless IC device according to claim 1, wherein an imaginary portion of an input/output impedance of the wireless IC device conjugates with the imaginary portion of an impedance when viewed from a portion of the feeder circuit substrate, connected to the wireless IC, toward the feeder electrode within or near a range of frequency used.
›26.↳ 1An electronic apparatus comprising the wireless IC device according to claim 1.d2
An electronic apparatus comprising the wireless IC device according to claim 1.
›27.↳ 1An electronic apparatus comprising the wireless IC device according to claim 1, wherein the radiation plate is provided for a printed wiring board inc…d2
An electronic apparatus comprising the wireless IC device according to claim 1, wherein the radiation plate is provided for a printed wiring board incorporated in an apparatus casing, and the feeder electrode provided for the feeder circuit substrate is electromagnetically coupled to the radiation plate.
