The solder paste printing method of the present invention mounts a solder paste containing therein as a solder material a Snâ€”Zn system solder on a mask, and urges the solder paste to make rolling over the mask from one end thereof toward the opposite thereof by means of a squeegee to thereby fill the solder paste into apertures formed in the mask. At this time, by maintaining moisture contained in the atmosphere surrounding the solder paste at a value equal to or less than a predetermined value, as the solder paste is suppressed from causing an increase in the viscosity thereof due to the reaction with the moisture in the surrounding atmosphere during the solder paste printing process, the rolling ability of the solder paste during the printing process can be kept, and attachment of the solder paste to the squeegee can be prevented.

Claims

6 · 2 independent · depth 3

6 granted claims

›1.independentA solder paste printing method comprising:na first process for mounting a mask having apertures corresponding to land portions of a printed circuit bo…+2

›4.independentA solder paste printing apparatus comprising:na mask having apertures corresponding to land portions of a printed circuit board; a squeegee urging a s…+2

Classifications

5 codes

IPC · International Patent Classification

Section B — Performing operations; transporting

B23K031/02

USPC · US Patent Classification

228/248.1228/214228/35228/39

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File wrapper

Pendency

2.7 y

999 days filing → grant

Office actions

non-final + final

Responses

3 RCE

Examiner

M. Alexandra Elve

art unit 1725 · TC 1700

Law firm

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Citations: 14 back · 0 forward

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Priority chain

1 priority documents

›Priority documents — 1

Type	Document	Date
related publication	US 20020179695 A1	5 Dec 2002

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