Method of manufacturing semiconductor device
Granted 24 Aug 2004 · 2 office actions
Current assignee: Renesas Electronics Corporation · originally Mitsubishi Electric Corporation
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Inventors: Hirokazu Sayama, Kohei Sugihara · Examiner: John F. Niebling
Life of the patent
3 dated eventsAbstract
When a dummy sidewall and source and drain regions are once formed and then the dummy sidewall is removed to extend the source and drain regions, the removal of the dummy sidewall is performed after formation of a protective oxide film on a gate electrode and on the major surfaces of the source and drain regions. This efficiently prevents conventional surface roughness of the upper surface of the gate electrode and the impurity region due to the removal of the dummy sidewall.
Classifications
4 codes- H01L2/1336
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1 priority documents›Priority documents — 1
| Type | Document | Date |
|---|---|---|
| related publication | US 20030170958 A1 | 11 Sep 2003 |
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