USPatentGranted
B2

Method of manufacturing semiconductor device

Granted 24 Aug 2004 · 2 office actions

Life of the patent

3 dated events
⤢ drag to zoomOct 2002Jan 2003Apr 2003Jul 2003Oct 2003Jan 2004Apr 2004Jul 2004Oct 2004Prosecution
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Abstract

When a dummy sidewall and source and drain regions are once formed and then the dummy sidewall is removed to extend the source and drain regions, the removal of the dummy sidewall is performed after formation of a protective oxide film on a gate electrode and on the major surfaces of the source and drain regions. This efficiently prevents conventional surface roughness of the upper surface of the gate electrode and the impurity region due to the removal of the dummy sidewall.

Classifications

4 codes
IPC · International Patent Classification
Section H — Electricity
  • H01L2/1336
USPC · US Patent Classification
438/305438/257438/303

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File wrapper

Pendency
1.9 y
708 days filing → grant
Office actions
1
non-final + final
Responses
1
1 RCE
Examiner
John F. Niebling
art unit —
Citations: 11 back · 0 forward

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Priority chain

1 priority documents
›Priority documents — 1
TypeDocumentDate
related publicationUS 20030170958 A111 Sep 2003

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