USPatentGranted

Thermal head, method of manufacturing the same, and thermal stencil making apparatus using the same

Granted 29 May 2001 · no office action yet

Assignee: Riso Kagaku Corporation

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Inventors: Hikaru Oike · Examiner: Huan Tran

Application
650819
filed 30 Aug 2000
Publication
Not published
not published
Patent· this page
US 6,239,826
granted 29 May 2001

Life of the patent

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Abstract

A thermal head includes a heat radiating plate and an electrical insulating substrate which is provided with a plurality of resistance heater elements arranged in a direction over a predetermined length and a plurality of electrodes for energizing the resistance heater and is integrated with the heat radiating plate. The substrate is smaller than the heat radiating plate in coefficient of thermal expansion and is fixed to the heat radiating plate at a temperature higher than the normal working temperature range of the thermal head. In the normal working temperature range of the thermal head, the thermal head is convex toward the resistance heater in a cross-section taken along a line parallel to the direction in which the resistance heater elements are arranged due to the difference in coefficient of thermal expansion between the heat radiating plate and the substrate.

Claims

7 · 3 independent · depth 2
1234567
7 granted claims

Classifications

2 codes
USPC · US Patent Classification
347/205347/200

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Pendency
0.7 y
272 days filing → grant
Office actions
0
on the grant's record
Examiner
Huan Tran
art unit —
Citations: 3 back · 0 forward

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