A method for mounting an integrated circuit includes a plurality of solder balls arrayed on the bottom surface of a package of the integrated circuit onto to a circuit board. These solder balls provide for surface mounting of the integrated circuit to a circuit board by solder reflow. The array of solder balls can be planarized so that each of the plural solder balls participate in defining a truly planar solder ball contact array for the integrated circuit package. Methods of manufacturing the integrated circuit with a package having planarized solder balls in an array dependent from a bottom surface thereof are set forth. The truly planarized solder ball contact array of the integrated circuit package affords nearly absolute reliability in forming of surface-mount electrical connections between the integrated circuit package and the circuit board on which the package is to mount. Additionally, the planarized solder ball contacts locally compensate individually for warpage of the integrated circuit package by variation in the individual dimensions of dependency of each solder ball below the bottom surface of the package.

Claims

56 · 5 independent · depth 4

56 granted claims

›1.independentA solder ball array planarizing method, comprising the steps of: providing an integrated circuit package and an array of solder balls depending theref…+19

›2.↳ 1The method of claim 1 wherein the package includes a package base member and an integrated circuit chip supported by the base member, and the array of…d2

›3.↳ 1The method of claim 1 wherein the surface is a surface of a device, and said heating step includes using a heating element inside of the device.d2+3

›7.↳ 1The method of claim 1 wherein said heating step includes applying a voltage to a heating element in thermal contact with the surface.d2

›8.↳ 1The method of claim 1 wherein said moving step includes holding the package with a device.d2+3

›12.↳ 1The method of claim 1 wherein said continuing does not wet the surface.d2

›13.↳ 1The method of claim 1 wherein a bottom surface of the package is warped, and the array of solder balls depend from the warped bottom surface and there…d2

›14.↳ 1The method of claim 1 wherein said moving step includes lowering the array towards the surface.d2

›15.↳ 1The method of claim 1 further comprising after said continuing step, moving at least one of the array and surface away from the other to thereby separ…d2+5

›21.independentA solder ball array planarizing method, comprising the steps of: providing an integrated circuit package and an array of solder balls depending theref…+12

›22.↳ 21The method of claim 21 wherein the package includes a base member and an integrated circuit chip supported by the base member.d2+1

›24.↳ 21The method of claim 21 wherein said engaging step includes holding the package with a device.d2+3

›28.↳ 21The method of claim 21 wherein said engaging step does not wet the surface.d2

›29.↳ 21The method of claim 21 wherein said engaging step includes heating at least some of the solder balls to soften same.d2

›30.↳ 21The method of claim 21 wherein said package providing step includes providing a plurality of round solder balls and securing the round solder balls to…d2+3

›34.independentA solder ball array planarizing method, comprising the steps of: providing an integrated circuit package having a base member and an integrated circui…+8

›35.↳ 34The method of claim 34 wherein said heating step includes applying a voltage to a heating element in thermal contact with the surface.d2

›36.↳ 34The method of claim 34 wherein said array providing step includes providing a plurality of round solder balls and securing the round solder balls to t…d2+3

›40.↳ 34The method of claim 34 wherein a bottom surface of the package is warped, and the array of solder balls depend from the warped bottom surface and ther…d2

›41.↳ 34The method of claim 34 further comprising after said continuing step, moving at least one of the array and surface away from the other to thereby sepa…d2+1

›43.independentA solder ball array planarizing method, comprising the steps of: providing an integrated circuit package having a plurality of round solder balls secu…+6

›50.independentA solder ball array planarizing method, comprising the steps of: providing an integrated circuit package having a plurality of round solder balls secu…+6

Classifications

3 codes

USPC · US Patent Classification

298/40298/4329D/IG4.4

Claim changes

Soon

Coming soonHow the claims changed between publication and grant

See which claims were amended, added or cancelled during examination, with every added and removed word marked.

AmendedAddedCancelledUnchanged

The published claims of this patent are not paired with the granted ones in what we hold.

File wrapper

Pendency

1.5 y

558 days filing → grant

Office actions

on the grant's record

Examiner

Peter Vo

art unit —

Law firm

Law firm · Log in to unlock

Citations: 17 back · 3 forward

Term & fees

See the term timeline — pendency span, in-force span, the maintenance fees paid and both computed expiry dates.

Validity challenges

See the validity challenges on record — reexaminations, IPRs and PGRs, with their institution decisions and outcomes.

Citations

See every patent this one cites and every patent that cites it back — publication, assignee, and how each one was found.