Method of manufacturing a head assembly

A method for the manufacture of a head assembly for use in a VCR, the method comprising the steps of: providing a first non-magnetic substrate wafer; forming a first magnetic core on top of the non-magnetic substrate wafer; depositing a first insulating layer on top of the first magnetic core; forming a magneto-resistive layer on top of the first insulating layer; patterning the magneto-resistive layer into a magneto-resistive core; depositing a conducting layer on top of the magneto-resistive core and the first insulating layer; removing portions of the conducting layer to thereby form a pair of conducting plates; forming a second insulating layer on top of the magneto-resistive core and the pair of conducting plates; depositing a second magnetic layer on top of the second insulating layer; patterning the second magnetic layer into a second magnetic core; forming a third insulating layer on top of the second magnetic core and the second insulating layer; depositing a conducting coil layer on top of the third insulating layer; removing portions of the conducting coil layer to thereby form a conducting coil; forming a fourth insulating layer on top of the third insulating layer and the conducting coil; removing portions of the fourth insulating layer and the third insulating layer formed on top of the second magnetic core; depositing a third magnetic layer on top of the fourth insulating layer while filling in the gaps left by the removed portions of the fourth insulating layer and the third insulating layer; patterning the third magnetic layer into a third magnetic core; depositing a fifth insulating layer on top of the third magnetic core and the fourth insulating layer; cutting the first non-magnetic substrate wafer and the layers deposited thereon into a plurality of slices; affixing a second non-magnetic substrate block layer on top of each slice; cutting each slice into a plurality of head chips; attaching a pair of flexible printed circuit boards ("FPCB") to each head chip; and installing the head chips and the attached FPCBs onto a plurality of head bases.

A method for the manufacture of a head assembly for use in a VCR, the method comprising the steps of: providing a first non-magnetic substrate wafer; forming a first magnetic core on top of the non-magnetic substrate wafer; depositing a first insulating layer on top of the first magnetic core; forming a magneto-resistive layer on top of the first insulating layer; patterning the magneto-resistive layer into a magneto-resistive core; depositing a conducting layer on top of the magneto-resistive core and the first insulating layer; removing portions of the conducting layer to thereby form a pair of conducting plates; forming a second insulating layer on top of the magneto-resistive core and the pair of conducting plates; providing a second non-magnetic substrate wafer; forming a second magnetic layer on top of the second non-magnetic substrate wafer; patterning the second magnetic layer into a second magnetic core; depositing a third insulating layer on top of the second magnetic core and the second insulating layer; forming a conducting coil layer on top of the third insulating layer; removing portions of the conducting coil layer to thereby give rise to a conducting coil; forming a fourth insulating layer on top of the third insulating layer and the conducting coil; removing portions of the fourth insulating layer and the third insulating layer formed on top of the second magnetic core; forming a third magnetic layer on top of the fourth insulating layer while filling in the gaps left by the removed portions of the fourth insulating layer and the third insulating layer; patterning the third magnetic layer into a third magnetic core; depositing a fifth insulating layer on top of the third magnetic core and the fourth insulating layer; cutting the first non-magnetic substrate wafer and the layers deposited thereon into a plurality of slices; cutting the second non-magnetic substrate wafer and the layers deposited thereon into a plurality of slices; combining the slices with the magneto-resistive heads with the slices with the thin film heads to thereby form a plurality of slices containing thin film heads and magneto-resistive heads; cutting each slice obtained by combining the slices with the magneto-resistive heads and the slices with the thin film heads into a plurality of head chips; attaching a pair of flexible printed circuit boards ("FPCB") to each head chip; and installing the head chips and the attached FPCBs onto a plurality of head bases.