USPatentGranted

Cleaning method for semiconductor wafer processing apparatus

Granted 30 Jul 1991 · no office action yet

Assignee: Applied Materials, Inc.

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Inventors: Naoaki Kobayashi, Jerry Wong, Makoto Nagashima · Examiner: Anthony McFarlane

Application
411433
filed 22 Sep 1989
Publication
Not published
not published
Patent· this page
US 5,035,751
granted 30 Jul 1991

Life of the patent

3 dated events
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Abstract

An improvement in a method for cleaning a CVD deposition chamber in a semiconductor wafer processing apparatus is described. The improvement comprises the treatment of fluorine residues in the CVD deposition chamber, left from a prior fluorine plasma cleaning step, by contacting such fluorine residues with one or more reducing gases which will react with the fluorine residues to form one or more gaseous or solid reaction products or a mixture of same.

Claims

20 · 3 independent · depth 4
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20 granted claims

Classifications

6 codes
USPC · US Patent Classification
134/22.1134/26156/345134/30134/36156/643

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Pendency
1.9 y
676 days filing → grant
Office actions
0
on the grant's record
Examiner
Anthony McFarlane
art unit —
Citations: 9 back · 4 forward

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