Epoxy resin composition

A method for adhering a first substrate to a second substrate comprising the steps of coating said first substrate with a storage-stable, thermally-curable, one-part epoxy resin composition comprising a curable glycidyl ether epoxide resin; a curative amount of an aliphatic or non-aromatic cyclic polyol having about 2 to 18 carbon atoms, at least two hydroxy groups of said polyol being primary or secondary, and said polyol being free of strong acid groups, and free of electron-withdrawing substituents and large groups which cause steric hindrance in the .alpha.-position in relation to the carbon atoms attached to the methylol groups of the polyol; and a catalytic amount of an imidazole compound selected from (a) compounds represented by the formula M.sup.1 (L.sup.1).sub.a (X.sup.1).sub.b where M.sup.1 is Ni.sup.++, Cu.sup.++, or Co.sup.++, L.sup.1 is ##STR26## where R.sup.2 is alkyl having 1 to 18 carbon atoms, cyanoalkyl having 1 to 4 carbon atoms, phenyl, or substituted phenyl, and R.sup.3 is alkylene having 1 to 18 carbon atoms, phenyl, or substituted phenyl, X.sup.1 is --R.sup.4 (COO.sup.-).sub.2 were R.sup.4 is phenyl, naphthyl, or C.sub.m H.sub.2m-1 where m is 0, 1, or 2, or X.sup.1 is --R.sup.5 (COO.sup.-).sub.e where R.sup.5 is phenyl or naphthyl and e is 3, 4, or 5, or X.sup.1 is an anion of a strong inorganic acid, a is 2, 4 or 6, and b is 0.5, 0.67, 1, or 2 depending on the valuence of X.sup.1 ; (b) compounds represented by the formula L.sup.2 X.sup.2 where L.sup.2 is ##STR27## where R.sup.6 is --H, --C.sub.n H.sub.2n+1 or ##STR28## n being a number of from 1 to 16, R.sup.7 is --H, --CH.sub.3, --C.sub.2 H.sub.5, --C.sub.2 H.sub.4 CN, or ##STR29## R.sup.8 is --H, --CH.sub.3, --C.sub.2 H.sub.5, --CH.sub.2 OH, or ##STR30## R.sup.9 is --H or --CH.sub.2 OH X.sup.2 is --R.sup.4 (COOH).sub.2 where R.sup.4 is phenyl, naphthyl, or C.sub.m H.sub.2m-1 where m is 0, 1, or 2, or X.sup.2 is --R.sup.5 (COOH).sub.e where R.sup.5 is phenyl or naphthyl and e is 3, 4, or 5, or X.sup.2 is isocyanuric acid; (c) compounds represented by the formula M.sup.3 (L.sup.3).sub.e where M.sup.3 is Ni.sup.++, Cu.sup.++, Co.sup.++, Zn.sup.++, Cu.sup.+, or Ag.sup.+, L.sup.3 is ##STR31## where R.sup.1 is --H, ##STR32## or C.sub.n H.sub.2n+1, n being a number of from 1 to 16, and each R.sup.2 is --CH.sub.3, ##STR33## or --CH.sub.2 OH, e is 1 or 2; (d) compounds represented by the formula L.sup.4 where L.sup.4 is ##STR34## where R.sup.6, R.sup.7, R.sup.8 and R.sup.9 are the same as for compound (b); and (e) a compound represented by the formula ##STR35## wherein X, Y and Z may be the same or different, and each may be hydrogen, a lower alkyl or aryl having 1-12 carbon atoms, halo or nitro and said imidazole being insoluble in said epoxide resin at temperatures of about 25.degree. to 35.degree. C.; and said resin composition having a pot life of at least 3 days at 22.degree. C. and at least 12 hours at 35.degree. C., contacting said second substrate with said coated first substrate, and heating said substrates to a temperature in the range of 100.degree. to 200.degree. C. to cure said composition and bond said substrates together.