USPatentGranted
B2

Current output circuit

Granted 28 Apr 2020 · 6 office actions

Assignee: Murata Manufacturing Co., Ltd.

Law firm: Law firm · Log in to unlock

Attorney: Attorney · Log in to unlock

Inventors: Yusuke Shimamune, Satoshi Tanaka, Fuminori Morisawa, Kazuhito Nakai +2 · Examiner: Khanh V Nguyen · AU 2842 · TC 2800

Life of the patent

3 dated events
⤢ drag to zoomJan 2018Apr 2018Jul 2018Oct 2018Jan 2019Apr 2019Jul 2019Oct 2019Jan 2020Apr 2020Jul 2020Prosecution
Prosecutionhover for detail · click to open

Abstract

Provided is a current output circuit that includes: a first FET that has a power supply voltage supplied to a source thereof, that has a first voltage supplied to a gate thereof and that outputs a first current from a drain thereof; a second FET that has the power supply voltage supplied to a source thereof, that has the first voltage supplied to a gate thereof and that outputs an output current from a drain thereof; a first control circuit that controls the first voltage such that the first current comes to be at a target level; and a second control circuit that performs control such that a drain voltage of the first FET and a drain voltage of the second FET are made equal to each other.

Description

10 parts
›This application is a continuation of U.S. patent…

This application is a continuation of U.S. patent application Ser. No. 15/274,539 filed Sep. 23, 2016 which claims priority from Japanese Patent Application No. 2015-197915 filed on Oct. 5, 2015. The contents of these applications are incorporated herein by reference in their entireties.

›BACKGROUND

The present disclosure relates to a current output circuit. In a power amplification module, a circuit that generates a prescribed output current is used in order to supply a bias current to a power amplifier. For example, in a circuit disclosed in Japanese Unexamined Patent Application Publication No. 11-186854, an output current is generated by using a current mirror circuit. Specifically, a voltage corresponding to a power supply voltage is applied to the drain of a diode-connected MOS transistor and an output current is output from the drain of a MOS transistor that is connected to the MOS transistor current mirror manner.

If the actual use conditions of a power amplification module are considered, there is a possibility that the power supply voltage will vary. Consequently, it is demanded that a stable output current be generated regardless of variations in the power supply voltage in order that a stable bias current be supplied in the power amplification module.

However, in the circuit disclosed in Japanese Unexamined Patent Application Publication No. 11-186854, the size of the output current depends upon the value of the applied power supply voltage. Consequently, there is a possibility that the output current will also vary with variations in the value of the power supply voltage.

›BRIEF SUMMARY

The present disclosure was made in light of the above-described circumstances and provides a current output circuit that can stably output a current regardless of variations in the power supply voltage.

In order to achieve this object, a current output circuit according to an embodiment of the present disclosure includes: a first FET that has a power supply voltage supplied to a source thereof, that has a first voltage supplied to a gate thereof and that outputs a first current from a drain thereof; a second FET that has the power supply voltage supplied to a source thereof, that has the first voltage supplied to a gate thereof and that outputs an output current from a drain thereof; a first control circuit that controls the first voltage such that the first current comes to be at a target level; and a second control circuit that performs control such that a drain voltage of the first FET and a drain voltage of the second FET are made equal to each other.

According to the embodiment of the present disclosure, a current output circuit can be provided that can stably output a current regardless of variations in the power supply voltage.

Other features, elements, characteristics and advantages of the present disclosure will become more apparent from the following detailed description of embodiments of the present disclosure with reference to the attached drawings.

›BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWINGS

FIG. 1 illustrates an example configuration of a power amplification module that includes a current output circuit according to an embodiment of the present disclosure;

FIG. 2 is a circuit diagram of a current output circuit according to a first embodiment of the present disclosure;

FIG. 3 is a circuit diagram of a current output circuit according to a second embodiment of the present disclosure;

FIG. 4 is a circuit diagram of a current output circuit according to a third embodiment of the present disclosure;

FIG. 5 is a circuit diagram of a current output circuit according to a fourth embodiment of the present disclosure;

FIG. 6 is a circuit diagram of a current output circuit according to a fifth embodiment of the present disclosure; and

FIG. 7 is a circuit diagram of a current output circuit according to a sixth embodiment of the present disclosure.

›DETAILED DESCRIPTION · 1 of 6

Hereafter, embodiments of the present disclosure will be described in detail while referring to the drawings. In addition, elements that are the same as each other will be denoted by the same symbols and repeated description thereof will be omitted.

FIG. 1 illustrates an example configuration of a power amplification module that includes a current output circuit according to an embodiment of the present disclosure.

As illustrated in FIG. 1 , a power amplification module 100 includes a current output circuit 101 , a bias circuit 102 and an amplification circuit 103 .

The current output circuit 101 is supplied with a power supply voltage Vdd and generates an output current Iout of a target level. The output current Iout is supplied to the bias circuit 102 .

The current output circuit 101 includes p-channel MOSFETs (MP 1 and MP 2 ) and first and second control circuits 110 and 111 .

The p-channel MOSFET (MP 1 ) (first FET) has the power supply voltage Vdd supplied to the source thereof, the gate thereof is connected to the first control circuit 110 and the drain thereof is connected to the second control circuit 111 .

The p-channel MOSFET (MP 2 ) (second FET) has the power supply voltage Vdd supplied to the source thereof, the gate thereof is connected to the gate of the p-channel MOSFET (MP 1 ) and the drain thereof is connected to the second control circuit 111 . Thus, the p-channel MOSFET (MP 2 ) is connected so as to have a common gate potential with the p-channel MOSFET (MP 1 ). Therefore, the current density of the p-channel MOSFET (MP 2 ) can be made the same as that of the p-channel MOSFET (MP 1 ).

The first control circuit 110 controls the gate voltages of the p-channel MOSFETs (MP 1 and MP 2 ) so that the output current Iout is at the target level. The second control circuit 111 performs control to make the drain voltages of the p-channel MOSFETs (MP 1 and MP 2 ) equal to each other. An output current Iout of the target level is output from the drain of the p-channel MOSFET (MP 2 ) as a result of the control performed by the first and second control circuits 110 and 111 . The details of the configurations of the first and second control circuits 110 and 111 will be described later.

The bias circuit 102 generates a bias current Ibias of a size corresponding to the output current Iout output from the current output circuit 101 . The bias current Ibias is supplied to the amplification circuit 103 .

The bias circuit 102 includes a voltage output circuit 120 , a bipolar transistor 121 and resistance elements 122 and 123 .

The voltage output circuit 120 outputs a voltage of a prescribed level (fourth voltage) on the basis of the output current Iout supplied from the current output circuit 101 . The voltage output circuit 120 includes bipolar transistors 124 and 125 , for example. The collector and base of the bipolar transistor 124 are connected to each other (hereafter, referred to as being “diode connected”), the collector of the bipolar transistor 124 is connected to a second terminal of the resistance element 122 and to the base of the bipolar transistor 121 , and the emitter of the bipolar transistor 124 is connected to the collector of the bipolar transistor 125 . The bipolar transistor 125 is diode connected, the collector thereof is connected to the emitter of the bipolar transistor 124 and the emitter thereof is grounded. Thus, a voltage of a prescribed level (for example, around 2.6 V) is generated at the collector of the bipolar transistor 124 .

The bipolar transistor 121 (second bipolar transistor) has the power supply voltage Vdd supplied to the collector thereof, the base thereof is connected to the second terminal of the resistance element 122 and to the collector of the bipolar transistor 124 , and the emitter thereof is connected to a first terminal of the resistance element 123 . The output current Iout output from the current output circuit 101 and the voltage output from the voltage output circuit 120 are supplied to the base of the bipolar transistor 121 . Thus, a bias current Ibias that corresponds to the output current Iout is output from the emitter of the bipolar transistor 121 .

The output current Iout is supplied to a first terminal of the resistance element 122 and the second terminal of the resistance element 122 is connected to the collector of the bipolar transistor 124 and to the base of the bipolar transistor 121 .

The first terminal of the resistance element 123 is connected to the emitter of the bipolar transistor 121 and a second terminal of the resistance element 123 is connected to the amplification circuit 103 .

The amplification circuit 103 amplifies a radio frequency (RF) signal RFin (input signal) up to the level that is required to transmit the signal to a base station and outputs an amplified signal RFout (output signal).

As illustrated in FIG. 1 , the amplification circuit 103 includes, for example, a capacitance element 130 , a resistance element 131 , an inductor 132 and a bipolar transistor 133 .

The radio frequency signal RFin is supplied to a first terminal of the capacitance element 130 from outside the amplification circuit 103 and a second terminal of the capacitance element 130 is connected to a first terminal of the resistance element 131 . The capacitance element 130 removes a direct-current component of the radio frequency signal RFin.

The first terminal of the resistance element 131 is connected to the second terminal of the capacitance element 130 and to the second terminal of the resistance element 123 and a second terminal of the resistance element 131 is connected to the base of the bipolar transistor 133 .

The power supply voltage Vdd is supplied to a first terminal of the inductor 132 and a second terminal of the inductor 132 is connected to the collector of the bipolar transistor 133 .

The bipolar transistor 133 (first bipolar transistor) has the power supply voltage Vdd supplied to the collector thereof via the inductor 132 , the base thereof is connected to the second terminal of the resistance element 131 and the emitter thereof is grounded. The radio frequency signal RFin supplied from outside the amplification circuit 103 and the bias current Ibias output from the bias circuit 102 are supplied to the base of the bipolar transistor 133 . Thus, the amplified signal RFout, which is obtained by amplifying the radio frequency signal RFin, is output from the collector of the bipolar transistor 133 . The gain in the amplification circuit 103 is controlled using the bias current Ibias supplied from the bias circuit 102 .

›DETAILED DESCRIPTION · 2 of 6

Hereafter, the configurations of the first and second control circuits 110 and 111 of the current output circuit 101 will be described in detail.

First Embodiment

FIG. 2 illustrates a current output circuit 101 A as an example of the current output circuit 101 . The current output circuit 101 A includes a first control circuit 110 A and a second control circuit 111 A.

The first control circuit 110 A includes an operational amplifier OP 1 , a current source J 1 and resistance elements R 1 and R 2 .

The second control circuit 111 A includes a p-channel MOSFET (MP 5 ) and an operational amplifier OP 2 .

The current source J 1 generates a reference current Iref, which is a constant current. The current source J 1 may change the size of the reference current Iref in accordance with a signal input from outside the current output circuit 101 A.

The reference current Iref is supplied to a first terminal of the resistance element R 1 and a second terminal of the resistance element R 1 is grounded. A reference voltage Vref that corresponds to the reference current Iref is generated at the first terminal of the resistance element R 1 .

A first terminal of the resistance element R 2 is connected to the drain of the p-channel MOSFET (MP 5 ) and a second terminal of the resistance element R 2 is grounded. A voltage Vdet (second voltage) that corresponds to a current Ids 1 (first current) that flows through the p-channel MOSFET (MP 1 ) is generated at the first terminal of the resistance element R 2 .

The reference voltage Vref is supplied to an inverting input terminal of the operational amplifier OP 1 (first operational amplifier), the voltage Vdet is supplied to a non-inverting input terminal of the operational amplifier OP 1 and an output terminal of the operational amplifier OP 1 is connected to the gates of the p-channel MOSFETs (MP 1 and MP 2 ). The operational amplifier OP 1 controls the gate voltages of the p-channel MOSFETs (MP 1 and MP 2 ) so that the voltage Vdet becomes equal to the reference voltage Vref.

The p-channel MOSFET (MP 5 ) (fifth FET) has the source thereof connected to the drain of the p-channel MOSFET (MP 1 ), the gate thereof connected to an output terminal of the operational amplifier OP 2 and the drain thereof connected to the first terminal of the resistance element R 2 .

The drain voltage of the p-channel MOSFET (MP 1 ) is supplied to the inverting input terminal of the operational amplifier OP 2 (second operational amplifier), the drain voltage of the p-channel MOSFET (MP 2 ) is supplied to the non-inverting input terminal of the operational amplifier OP 2 and the output terminal of the operational amplifier OP 2 is connected to the gate of the p-channel MOSFET (MP 5 ). The operational amplifier OP 2 controls the gate voltage of the p-channel MOSFET (MP 5 ) so that the drain voltages of the p-channel MOSFETs (MP 1 and MP 2 ) become equal to each other.

Hereafter, the control performed by the first and second control circuits 110 A and 111 A will be described.

First, the control performed by the first control circuit 110 A will be described.

The first control circuit 110 A controls the gate voltages of the p-channel MOSFETs (MP 1 and MP 2 ) on the basis of the reference voltage Vref corresponding to the reference current Iref. Specifically, the operational amplifier OP 1 operates such that the inverting input terminal and the non-inverting input terminal thereof come to be at the same potential.

For example, when the voltage Vdet is lower than the reference voltage Vref as a result of the current Ids 1 flowing through the p-channel MOSFET (MP 1 ) being small, the operational amplifier OP 1 decreases the output voltage thereof. Consequently, a gate-source voltage Vgs 1 of the p-channel MOSFET (MP 1 ) increases and the current Ids 1 increases. Conversely, when the voltage Vdet is higher than the reference voltage Vref as a result of the current Ids 1 flowing through the p-channel MOSFET (MP 1 ) being large, the operational amplifier OP 1 increases the output voltage thereof. Consequently, the gate-source voltage Vgs 1 of the p-channel MOSFET (MP 1 ) decreases and the current Ids 1 decreases. In this way, the first control circuit 110 A performs control in order to make the current Ids 1 be of a constant size that corresponds to the reference current Iref.

Before describing the control performed by the second control circuit 111 A, a configuration that does not include the second control circuit 111 A will be imagined.

The power supply voltage Vdd may vary between 3.0 V and 4.6 V, for example. At this time, a drain-source voltage Vds 1 of the p-channel MOSFET (MP 1 ) changes in accordance with the size of the current Ids 1 flowing through the p-channel MOSFET (MP 1 ). However, an output voltage Vout, which is the drain voltage of the p-channel MOSFET (MP 2 ), depends on the I-V (current-voltage) characteristics of load elements (for example, bipolar transistors 124 and 125 ) in the bias circuit 102 , which is the destination to which the output current Iout of the p-channel MOSFET (MP 2 ) is supplied, and is 2.8 V, for example. Therefore, for example, the output voltage Vout is 2.8 V when the power supply voltage Vdd is 3.0 V, and the voltage difference therebetween (=drain-source voltage Vds 2 of p-channel MOSFET (MP 2 )) is 3.0 V−2.8 V=0.2 V. Therefore, a difference is generated between the drain-source voltage Vds 1 of the p-channel MOSFET (MP 1 ) and the drain-source voltage Vds 2 of the p-channel MOSFET (MP 2 ).

Here, the p-channel MOSFETs have a characteristic that, if the gate voltage is fixed, the size of the current suddenly drops when the drain-source voltage falls below a prescribed level. Consequently, if the drain-source voltage Vds 2 of the p-channel MOSFET (MP 2 ) falls below the prescribed level with a decrease in the power supply voltage Vdd, the p-channel MOSFET (MP 2 ) will become unable to output an output current Iout of the target level that is proportional to the current Ids 1 flowing through the p-channel MOSFET (MP 1 ).

›DETAILED DESCRIPTION · 3 of 6

Next, the control performed by the second control circuit 111 A will be described.

In the current output circuit 101 A, the second control circuit 111 A operates so that the drains of the p-channel MOSFETs (MP 1 and MP 2 ) come to be at the same potential. In the case where the drain voltage of the p-channel MOSFET (MP 2 ) is higher than the drain voltage of the p-channel MOSFET (MP 1 ), the gate voltage of the p-channel MOSFET (MP 5 ) rises due to control of the operational amplifier OP 2 . Then, the source voltage of the p-channel MOSFET (MP 5 ) (=drain voltage of p-channel MOSFET (MP 1 )) rises. Thus, the drain voltage of the p-channel MOSFET (MP 1 ) comes to be at the same level as the drain voltage of the p-channel MOSFET (MP 2 ).

At this time, the drain-source voltage Vds 1 of the p-channel MOSFET (MP 1 ) falls due to the increase in the drain voltage of the p-channel MOSFET (MP 1 ). However, the gate voltage of the p-channel MOSFET (MP 1 ) falls due to control of the operational amplifier OP 1 , and as a result a current Ids 1 that corresponds to the reference current Iref flows in the p-channel MOSFET (MP 1 ). Since the gate voltage of the p-channel MOSFET (MP 2 ) also falls, an output current Iout of the target level that is proportional to the current Ids 1 flows in the p-channel MOSFET (MP 2 ).

As described above, the first control circuit 110 A performs control such that the current Ids 1 that flows in the p-channel MOSFET (MP 1 ) has a size that corresponds to the reference current Iref. In addition, the second control circuit 111 A performs control such that the drain voltages of the p-channel MOSFETs (MP 1 and MP 2 ) come to be at the same potential. Thus, it is possible to provide a current output circuit that can stably output a current regardless of variations in the power supply voltage Vdd.

Furthermore, if the second control circuit 111 A were not provided, it would be necessary to use a p-channel MOSFET having a large gate width as the p-channel MOSFET (MP 2 ) in order to stably output a current under conditions where the potential difference between the output voltage Vout and the power supply voltage Vdd is small. However, by using the second control circuit 111 A in the current output circuit 101 A, the same output current Iout as in a configuration not provided with the second control circuit 111 A can be obtained by using a p-channel MOSFET of a small size.

Second Embodiment

FIG. 3 illustrates a current output circuit 101 B as an example of the current output circuit 101 . Elements that are the same as those of the current output circuit 101 A are denoted by the same symbols and description thereof is omitted. The current output circuit 101 B includes a second control circuit 111 B instead of the second control circuit 111 A of the current output circuit 101 A.

The second control circuit 111 B includes p-channel MOSFETs (MP 6 and MP 7 ) and a current source J 2 .

The p-channel MOSFET (MP 6 ) (sixth FET) has the source thereof connected to the drain of the p-channel MOSFET (MP 2 ), the gate thereof connected to the drain thereof and the drain thereof connected to the current source J 2 .

The p-channel MOSFET (MP 7 ) (seventh FET) has the source thereof connected to the drain of the p-channel MOSFET (MP 1 ), the gate thereof connected to the gate of the p-channel MOSFET (MP 6 ) and the drain thereof connected to the first terminal of the resistance element R 2 . Thus, the p-channel MOSFET (MP 7 ) is connected to the p-channel MOSFET (MP 6 ) in a current mirror manner. Therefore, the current density of the p-channel MOSFET (MP 7 ) can be made the same as that of the p-channel MOSFET (MP 6 ).

The current source J 2 outputs a prescribed fixed current (third current).

In the current output circuit 101 B as well, the second control circuit 111 B operates so that the drain voltages of the p-channel MOSFETs (MP 1 and MP 2 ) come to be at the same potential, similarly to as in the current output circuit 101 A.

Specifically, if Vd 1 and Vd 2 represent the drain voltages of the p-channel MOSFETs (MP 1 and MP 2 ) and Vgs 6 and Vgs 7 represent the gate-source voltages of the p-channel MOSFETs (MP 6 and MP 7 ), respectively, since the gates of the p-channel MOSFETs (MP 6 and MP 7 ) are connected to each other, Vd 1 −Vgs 7 =Vd 2 −Vgs 6 . Here, in the case where the current densities of the p-channel MOSFETs (MP 6 and MP 7 ) are equal to each other, the gate-source voltages Vgs 6 and Vgs 7 of the p-channel MOSFETs (MP 6 and MP 7 ) become equal to each other. Therefore, Vd 1 =Vd 2 .

Therefore, in this configuration as well, the drain voltages Vd 1 and Vd 2 of the p-channel MOSFETs (MP 1 and MP 2 ) are maintained at the same potential and the same effect as with the current output circuit 101 A can be obtained.

Third Embodiment

FIG. 4 illustrates a current output circuit 101 C as an example of the current output circuit 101 . Elements that are the same as those of the current output circuit 101 B are denoted by the same symbols and description thereof is omitted. The current output circuit 101 C includes a first control circuit 110 B instead of the first control circuit 110 A of the current output circuit 101 B.

The first control circuit 110 B includes n-channel MOSFETs (MN 3 and MN 4 ) and the current source J 1 .

The n-channel MOSFET (MN 3 ) (third FET) has the drain thereof connected to the current source J 1 , the gate thereof connected to the drain thereof, and the source thereof grounded.

The n-channel MOSFET (MN 4 ) (fourth FET) has the drain thereof connected to the drain of the p-channel MOSFET (MP 7 ), the gate thereof connected to the gate of the n-channel MOSFET (MN 3 ) and the source thereof grounded. Thus, the n-channel MOSFET (MN 4 ) is connected to the n-channel MOSFET (MN 3 ) in a current mirror manner. The drain voltage (third voltage) of the n-channel MOSFET (MN 3 ) is supplied to the gates of the n-channel MOSFETs (MN 3 and MN 4 ). Furthermore, the gate voltage (first voltage) of the p-channel MOSFETs (MP 1 and MP 2 ) is controlled by the drain voltage of the n-channel MOSFET (MN 4 ).

›DETAILED DESCRIPTION · 4 of 6

In the first control circuit 110 B, the n-channel MOSFET (MN 4 ) is connected to the n-channel MOSFET (MN 3 ) in a current mirror manner when each of the MOSFETs is in a saturated state and therefore a current Ids 4 that is proportional to a current (second current) that corresponds to the reference current Iref flows in the n-channel MOSFET (MN 4 ). A current that corresponds to the reference current Iref also flows in the p-channel MOSFET (MP 1 ), which is connected to the n-channel MOSFET (MN 4 ) via the p-channel MOSFET (MP 7 ), and in the p-channel MOSFET (MP 2 ), which is connected to the p-channel MOSFET (MP 1 ) in a mirror current manner.

Furthermore, the drain voltages Vd 1 and Vd 2 of the p-channel MOSFETs (MP 1 and MP 2 ) are maintained at the same potential as described above by operation of the second control circuit 111 B. At this time, the drain-source voltage Vds 1 of the p-channel MOSFET (MP 1 ) falls due to the increase in the drain voltage Vd 1 of the p-channel MOSFET (MP 1 ). However, a drain voltage Vd 4 of the n-channel MOSFET (MN 4 ) is supplied to the gates of the p-channel MOSFETs (MP 1 and MP 2 ). Here, the drain voltage Vd 4 is a voltage that is lower than the drain voltage Vd 1 of the p-channel MOSFET (MP 1 ) by the drain-source voltage Vds 7 of the p-channel MOSFET (MP 7 ). Therefore, the gate voltages of the p-channel MOSFETs (MP 1 and MP 2 ) can be reduced compared with the case where the second control circuit 111 B is not provided. Consequently the currents Ids 1 and Ids 2 flowing in the p-channel MOSFETs (MP 1 and MP 2 ) increase and an output current Iout of the target level that is proportional to the current Ids 1 is easily obtained.

Therefore, by using a simpler configuration than the current output circuit 101 B, the same effect as with the current output circuit 101 A can be obtained in this configuration as well.

Fourth Embodiment

FIG. 5 illustrates a current output circuit 101 D as an example of the current output circuit 101 . Elements that are the same as those of the current output circuit 101 C are denoted by the same symbols and description thereof is omitted. The current output circuit 101 D includes a second control circuit 111 C instead of the second control circuit 111 B of the current output circuit 101 C.

The configuration of the second control circuit 111 C differs from that of the second control circuit 111 B illustrated in FIG. 4 in that the second control circuit 111 C includes an n-channel MOSFET (MN 8 ) instead of the current source J 2 .

The n-channel MOSFET (MN 8 ) (eighth FET) has the drain thereof connected to the drain of the p-channel MOSFET (MP 6 ), the gate thereof connected to the gate of the n-channel MOSFET (MN 3 ) and the source thereof grounded. Thus, the n-channel MOSFET (MN 8 ) is connected to the n-channel MOSFET (MN 3 ) in a current mirror manner.

Consequently, a current Ids 8 that flows in the n-channel MOSFET (MN 8 ) has a size that corresponds to the reference current Iref. Therefore, the sizes of the currents Ids 6 and Ids 8 that flow through the p-channel MOSFET (MP 6 ) and the n-channel MOSFET (MN 8 ) are regulated by following the changes in the size of the reference current Iref and the size of the current Ids 2 that flows in the p-channel MOSFET (MP 2 ) also changes.

Here, the output current Iout of the current output circuit 101 D has a size obtained by subtracting the current Ids 6 (≈current Ids 8 ) from the current Ids 2 that flows in the p-channel MOSFET (MP 2 ). Therefore, the size of the output current Iout also changes with the change in the size of the reference current Iref.

Therefore, the current output circuit 101 D can improve the performance with which the output current Iout follows the reference current Iref when the size of the reference current Iref changes, compared with the current output circuit 101 C.

Fifth Embodiment

FIG. 6 illustrates a current output circuit 101 E as an example of the current output circuit 101 . Elements that are the same as those of the current output circuit 101 C are denoted by the same symbols and description thereof is omitted. The current output circuit 101 E includes a first control circuit 110 C instead of the first control circuit 110 B of the current output circuit 101 C.

The configuration of the first control circuit 110 C differs from that of the first control circuit 110 B illustrated in FIG. 4 in that the first control circuit 110 C further includes n-channel MOSFETs (MN 9 and MN 10 ).

The n-channel MOSFETs (MN 9 and MN 10 ) are arranged so as to be cascode-connected with the n-channel MOSFETs (MN 3 and MN 4 ). Specifically, the n-channel MOSFET (MN 9 ) (ninth FET) has the power supply voltage Vdd supplied to the drain thereof, the gate thereof is connected to the drain thereof and the source thereof is connected to the drain of the n-channel MOSFET (MN 3 ).

The n-channel MOSFET (MN 10 ) (tenth FET) has the drain thereof connected to the drain of the p-channel MOSFET (MP 7 ), the gate thereof connected to the gate of the n-channel MOSFET (MN 9 ) and the source thereof connected to the drain of the n-channel MOSFET (MN 4 ). Thus, the n-channel MOSFET (MN 10 ) is connected to the n-channel MOSFET (MN 9 ) in a current mirror manner.

The n-channel MOSFET (MN 10 ) can be made to have the same current density as the n-channel MOSFET (MN 9 ).

In the first control circuit 110 C, the sources of the n-channel MOSFETs (MN 3 and MN 4 ) are grounded and therefore the drain voltages of the n-channel MOSFETs (MN 3 and MN 4 ) are equal to drain-source voltages Vds 3 and Vds 4 of the n-channel MOSFETs (MN 3 and MN 4 ). If we denote the gate-source voltages of the n-channel MOSFETs (MN 9 and MN 10 ) as Vgs 9 and Vgs 10 , since the gates of the n-channel MOSFETs (MN 9 and MN 10 ) are connected to each other, Vds 3 +Vgs 9 =Vds 4 +Vgs 10 . Here, when the current densities of the n-channel MOSFETs (MN 9 and MN 10 ) are equal to each other, the gate-source voltages Vgs 9 and Vgs 10 of the n-channel MOSFETs (MN 9 and MN 10 ) are equal to each other. Therefore, Vds 3 =Vds 4 .

›DETAILED DESCRIPTION · 5 of 6

Consequently, generation of a voltage difference between the drain-source voltages Vds 3 and Vds 4 of the n-channel MOSFETs (MN 3 and MN 4 ) is prevented and the accuracy with which the current Ids 4 that flows in the n-channel MOSFET (MN 4 ) mirrors the current Ids 3 that flows in the n-channel MOSFET (MN 3 ) is improved. Therefore, an error in the size of the current Ids 1 that flows in the p-channel MOSFET (MP 1 ) is reduced (becomes less likely to be affected by variations in power supply voltage Vdd) and as a result an effect of preventing an error in the output current Iout with respect to variations in the power supply voltage Vdd is improved in the current output circuit 101 E compared with the current output circuit 101 C.

In the current output circuit 101 E as well, it is possible to form the current source J 2 using an n-channel MOSFET (MN 8 ) that is connected in a current mirror manner to an n-channel MOSFET (MN 3 ) in the second control circuit 111 B, similarly to as in the second control circuit 111 C illustrated in FIG. 5 . Thus, the accuracy with which the output current Iout follows the reference current Iref can be improved, similarly to as in the current output circuit 101 D.

Sixth Embodiment

FIG. 7 illustrates a current output circuit 101 F as an example of the current output circuit 101 . Elements that are the same as those of the current output circuit 101 E are denoted by the same symbols and description thereof is omitted. The current output circuit 101 F includes a first control circuit 110 D instead of the first control circuit 110 C of the current output circuit 101 E.

The configuration of the first control circuit 110 D differs from that of the first control circuit 110 C illustrated in FIG. 6 in that the first control circuit 110 D further includes a current source J 3 and an n-channel MOSFET (MN 11 ).

The first control circuit 110 D forms a low-voltage cascode connection. Specifically, the n-channel MOSFET (MN 11 ) (eleventh FET) has a constant current generated by the current source J 3 supplied to the drain thereof, the gate thereof is connected to the drain thereof and the source thereof is grounded. In addition, the gates of the n-channel MOSFETs (MN 9 and MN 10 ) are connected to the drain of the n-channel MOSFET (MN 11 ). The gates of the n-channel MOSFETs (MN 3 and MN 4 ) are connected to the drain of the n-channel MOSFET (MN 9 ).

Next, the lowest necessary voltage value VddE of the power supply voltage in the first control circuit 110 C illustrated in FIG. 6 will be considered. The voltage value VddE needs to be higher than a drain voltage Vd 9 of the n-channel MOSFET (MN 9 ). Here, the drain voltage Vd 9 is equal to the gate voltage of the n-channel MOSFET (MN 9 ), that is, has a voltage value (Vd 3 +Vgs 9 ) obtained by adding the gate-source voltage Vgs 9 of the n-channel MOSFET (MN 9 ) to the drain voltage Vd 3 of the n-channel MOSFET (MN 3 ). In addition, since the source of the n-channel MOSFET (MN 3 ) is grounded, the drain voltage Vd 3 is equal to a gate-source voltage Vgs 3 of the n-channel MOSFET (MN 3 ). Therefore, the lowest necessary voltage value VddE is equal to the drain voltage Vd 9 (=Vgs 3 +Vgs 9 )+V J1 . Here, the voltage V J1 is the lowest voltage at which the current source J 1 can operate.

On the other hand, in the case of the first control circuit 110 D illustrated in FIG. 7 , the drain voltage Vd 9 of the n-channel MOSFET (MN 9 ) is equal to the gate voltage of the n-channel MOSFET (MN 3 ), that is, the gate-source voltage Vgs 3 of the n-channel MOSFET (MN 3 ). In addition, the drain voltage of the n-channel MOSFET (MN 11 ) has a voltage value (Vd 3 +Vgs 9 ) obtained by adding the gate-source voltage Vgs 9 of the n-channel MOSFET (MN 9 ) to the drain voltage Vd 3 of the n-channel MOSFET (MN 3 ). Therefore, when VddF is the lowest necessary voltage value of the power supply voltage, the voltage value VddF is the higher one among Vgs 3 +V J1 and Vd 3 +Vgs 9 +V J3 . Here, the voltage V J3 is the lowest voltage at which the current source J 3 can operate. Since the drain voltage Vd 3 can be lower than the gate-source voltage Vgs 3 , the voltage value VddF can be lower than the voltage value VddE.

Therefore, the current output circuit 101 F can operate with a lower power supply voltage than the current output circuit 101 E.

In the current output circuit 101 F as well, it is possible to form the current source J 2 using an n-channel MOSFET (MN 8 ) that is connected to an n-channel MOSFET (MN 3 ) in a current mirror manner in the second control circuit 111 B, similarly to as in the second control circuit 111 C illustrated in FIG. 5 . Thus, the accuracy with which the output current Iout follows the reference current Iref can be improved, similarly to as in the current output circuit 101 D.

Exemplary embodiments of the present disclosure have been described above. The current output circuit 101 A to 101 F each include a first control circuit that controls the gate voltages of the p-channel MOSFETs (MP 1 and MP 2 ) that are connected to each other in a current mirror manner and a second control circuit that maintains the drain voltages of the p-channel MOSFETs (MP 1 and MP 2 ) so as to be equal to each other. The drain voltage of the p-channel MOSFET (MP 1 ) is controlled so as to be at the same potential as the drain voltage of the p-channel MOSFET (MP 2 ) by the second control circuit even when the power supply voltage Vdd varies. Therefore, it is easy to maintain the drain-source voltages Vds 1 and Vds 2 of the p-channel MOSFETs (MP 1 and MP 2 ) at the same potential.

In addition, the drain-source voltage Vds 1 of the p-channel MOSFET (MP 1 ) also decreases with a decrease in the drain-source voltage Vds 2 of the p-channel MOSFET (MP 2 ) due to the control performed by the second control circuit. However, with respect to the decrease in the drain-source voltage Vds 1 , the first control circuit controls the gate voltages of the p-channel MOSFET (MP 1 ) and the p-channel MOSFET (MP 2 ) when a larger current flows in the p-channel MOSFET (MP 1 ). Thus, a decrease in the output current Iout is prevented and the current supply performance of the p-channel MOSFET (MP 2 ) is easily secured.

›DETAILED DESCRIPTION · 6 of 6

Therefore, with the current output circuits 101 A to 101 F, a current can be stably output regardless of variations in the power supply voltage Vdd.

Furthermore, the current output circuit 101 D further includes the n-channel MOSFET (MN 8 ) in the second control circuit 111 C in contrast to the second control circuit 111 B. Thus, the size of the current Ids 6 that flows in the p-channel MOSFET (MP 6 ) is adjusted in accordance with changes in the reference current Iref and the size of the current Ids 2 that flows in the p-channel MOSFET (MP 2 ) also changes. Therefore, the current densities of the p-channel MOSFETs (MP 6 and MP 7 ) are the same and the drain voltages of the p-channel MOSFETs (MP 1 and MP 2 ) come closer to being at the same potential. In addition, since the current Ids 2 and the current Ids 6 change such that a ratio therebetween remains constant, the accuracy with which the output current Iout follows the reference current Iref can be improved compared with the current output circuit 101 C.

Furthermore, the current output circuit 101 E further includes the n-channel MOSFETs (MN 9 and MN 10 ) in the first control circuit 110 C, in contrast to the first control circuit 110 B. Thus, generation of a voltage difference between the drain-source voltages Vds 3 and Vds 4 of the n-channel MOSFETs (MN 3 and MN 4 ) is prevented and the accuracy with which the current Ids 4 that flows in the n-channel MOSFET (MN 4 ) mirrors the current Ids 3 that flows in the n-channel MOSFET (MN 3 ) is improved. Therefore, in the current output circuit 101 E, the effect of preventing an error in the output current Iout with respect to variations in the power supply voltage Vdd is improved compared with the current output circuit 101 C.

Furthermore, the current output circuit 101 F further includes the n-channel MOSFET (MN 11 ) in the first control circuit 110 D in contrast to the first control circuit 110 C. As a result, the lowest necessary voltage value of the power supply voltage is reduced. Therefore, the current output circuit 101 F can operate with a lower power supply voltage than the current output circuit 101 E.

In the current output circuits illustrated in FIGS. 1 to 7 , an n-channel MOSFET may be used instead of a p-channel MOSFET and a p-channel MOSFET may be used instead of an n-channel MOSFET as appropriate.

The purpose of the embodiments described above is to enable easy understanding of the present disclosure and the embodiments are not to be interpreted as limiting the present disclosure. The present disclosure can be modified or improved without departing from the gist of the disclosure and equivalents to the present disclosure are also included in the present disclosure. In other words, appropriate design changes made to the embodiments by one skilled in the art are included in the scope of the present disclosure so long as the changes have the characteristics of the present disclosure. For example, the elements included in the embodiments and the arrangements, materials, conditions, shapes, sizes and so forth of the elements are not limited to those exemplified in the embodiments and can be appropriately changed. In addition, the elements included in the embodiments can be combined as much as technically possible and such combined elements are also included in the scope of the present disclosure so long as the combined elements have the characteristics of the present disclosure.

While embodiments of the disclosure have been described above, it is to be understood that variations and modifications will be apparent to those skilled in the art without departing from the scope and spirit of the disclosure. The scope of the disclosure, therefore, is to be determined solely by the following claims.

1 of 10 part labels are ours — the grant heads the rest

Claims

16 · 3 independent · depth 4
12345678910111213141516
16 granted claims

Classifications

7 codes
IPC · International Patent Classification
Section G — Physics
  • G05F3/26
Section H — Electricity
  • H03F3/04
  • H03F1/30
  • H03F1/02
  • H03F3/21
  • H03F3/191
  • H03F3/193

Claim changes

Soon
Coming soonHow the claims changed between publication and grant

See which claims were amended, added or cancelled during examination, with every added and removed word marked.

AmendedAddedCancelledUnchanged

The published claims of this patent are not paired with the granted ones in what we hold.

File wrapper

Pendency
2.4 y
867 days filing → grant
Office actions
3
non-final + final
Responses
2
no RCE
Examiner
Khanh V Nguyen
art unit 2842 · TC 2800
Citations: 21 back · 0 forward

See the full prosecution history — every USPTO and applicant action on this file, in order.

Log in to unlock

Term & fees

See the term timeline — pendency span, in-force span, the maintenance fees paid and both computed expiry dates.

Log in to unlock

Priority chain

1 priority documents
›Priority documents — 1
TypeDocumentDate
related publicationUS 20180102742 A112 Apr 2018

Worldwide family

7 members · 3 offices
US4JP1CN2
this patentIP5 & PCTother officessolid = grantedhover for detail · click to open
Members
7
DOCDB simple family 58447686
Offices
3
US · JP · CN
Granted
3 of 7
grant date present
Non-English titles
1
shown as filed, never translated
›IP5 & PCT — 7 members
OfficePublicationKindPublishedFiledStatusTitle
USUS-2017099033-A1A16 Apr 201723 Sep 2016publishedCurrent output circuit
USUS-9882533-B2B230 Jan 201823 Sep 2016grantedCurrent output circuit
USUS-2018102742-A1A112 Apr 201813 Dec 2017publishedCurrent output circuit
USthis patentUS-10637401-B2B228 Apr 202013 Dec 2017grantedCurrent output circuit
JPJP-2017072911-AA13 Apr 20175 Oct 2015publishedCurrent output circuit
CNCN-106560758-AA12 Apr 201710 Oct 2016publishedCurrent output circuit
CNCN-106560758-BB22 May 201810 Oct 2016granted电流输出电路zh

Validity challenges

See the validity challenges on record — reexaminations, IPRs and PGRs, with their institution decisions and outcomes.

Log in to unlock

Citations

See every patent this one cites and every patent that cites it back — publication, assignee, and how each one was found.

Log in to unlock