A method is provided for manufacturing a printed circuit board assembly. A method includes applying a liquefied radiant-heat material on a heating component mounted on the printed circuit board; mounting a shield unit on the printed circuit board in contact with the liquefied radiant-heat material; and simultaneously curing the liquefied radiant-heat material and bonding the shield unit.

Claims

15 · 2 independent · depth 4

15 granted claims

›1.independentA method of manufacturing a printed circuit board assembly, the method comprising: applying solder to a plurality of bonding pads provided on the prin…+1

›3.independentA method of manufacturing a printed circuit board assembly, the method comprising: applying solder, at a first temperature, to a plurality of bonding …+12

›4.↳ 3The method of claim 3 , wherein no solder is applied to a bonding pad on which the shield unit is mounted.d2

›5.↳ 3The method of claim 3 , wherein the shield unit is mounted after solder is applied, at a second temperature, to a bonding pad for the shield unit.d2+1

›7.↳ 3The method of claim 3 , wherein the liquefied radiant-heat material is cured at at least one of a reflow soldering process temperature at which the el…d2

›8.↳ 3The method of claim 3 , wherein the liquefied radiant-heat material is primarily surface-hardened at at least one of a reflow soldering process temper…d2

›9.↳ 3The method of claim 3 , wherein the liquefied radiant-heat material has a predetermined viscosity to prevent a failure in bonding between the electron…d2

›10.↳ 3The method of claim 3 , wherein the liquefied radiant-heat material has a proper shape maintenance characteristic to sufficiently fill a gap between t…d2

›11.↳ 3The method of claim 3 , wherein the liquefied radiant-heat material completely fills an interior of the shield unit.d2

›12.↳ 3The method of claim 3 , wherein the liquefied radiant-heat material is applied through one of dispensing, jetting, and printing.d2

›13.↳ 3The method of claim 3 , further comprising applying an additional liquefied radiant-heat material on the shield unit for additional heat transfer to a…d2+2

Classifications

11 codes

IPC · International Patent Classification

Section H — Electricity

H01L23/10
H01L21/56
H01L23/373
H01L23/36
H01L23/427
H01L23/42
H05K3/32
H01L23/00
H05K3/34
H05K1/02
H01L23/552

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File wrapper

Pendency

3.8 y

1,391 days filing → grant

Office actions

non-final + final

Responses

no RCE

Examiner

Carl J Arbes

art unit 3729 · TC 3700

Law firm

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Citations: 38 back · 0 forward

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Priority chain

1 priority documents

›Priority documents — 1

Type	Document	Date
related publication	US 20160120039 A1	28 Apr 2016

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