A solid-state image pickup apparatus comprising: a photoelectric conversion unit disposed in a semiconductor substrate; a first transfer transistor configured to transfer carriers generated in the photoelectric conversion unit; a charge storage unit configured to store the carriers transferred from the photoelectric conversion unit; a second transfer transistor configured to transfer the carriers in the charge storage unit to a floating diffusion unit; and a metal film having a first portion disposed over a second gate electrode of the second transfer transistor and a second portion disposed between a first gate electrode of the first transfer transistor and the second gate electrode, wherein the first portion has an opening.
›2.↳ 1The solid-state image pickup apparatus according to claim 1 , further comprising a contact plug, wherein the contact plug is provided inside of the op…d2+6
The solid-state image pickup apparatus according to claim 1 , further comprising a contact plug, wherein the contact plug is provided inside of the opening in a planar view.
›6.↳ 2The solid-state image pickup apparatus according to claim 2 , further comprising a plurality of wiring layers, wherein the metal film is located close…d3+5
The solid-state image pickup apparatus according to claim 2 , further comprising a plurality of wiring layers, wherein the metal film is located closer to a surface of the semiconductor substrate than a top surface of the contact plug.
›9.↳ 6The solid-state image pickup apparatus according to claim 6 , further comprising another photoelectric conversion unit, another charge storage unit, a…d4+1
The solid-state image pickup apparatus according to claim 6 , further comprising another photoelectric conversion unit, another charge storage unit, another first gate electrode, and another second gate electrode, wherein the metal film extends over the another first gate electrode.
›11.↳ 9The solid-state image pickup apparatus according to claim 9 , wherein the first gate electrode is disposed between the photoelectric conversion unit a…d5
The solid-state image pickup apparatus according to claim 9 , wherein the first gate electrode is disposed between the photoelectric conversion unit and the charge storage unit.
›21.↳ 6The solid-state image pickup apparatus according to claim 6 , wherein the first portion overlaps an edge of the first gate electrode at a side of the …d4+2
The solid-state image pickup apparatus according to claim 6 , wherein the first portion overlaps an edge of the first gate electrode at a side of the charge storage unit.
›22.↳ 21The solid-state image pickup apparatus according to claim 21 , wherein the first gate electrode is disposed on the charge storage unit.d5+1
The solid-state image pickup apparatus according to claim 21 , wherein the first gate electrode is disposed on the charge storage unit.
›23.↳ 22The solid-state image pickup apparatus according to claim 22 , wherein the first portion is disposed over the first portion and the second portion, an…d6
The solid-state image pickup apparatus according to claim 22 , wherein the first portion is disposed over the first portion and the second portion, and wherein the second portion extends from the first portion toward a surface of the semiconductor substrate.
›3.↳ 1The solid-state image pickup apparatus according to claim 1 , wherein the first portion is disposed over the first gate electrode.d2
The solid-state image pickup apparatus according to claim 1 , wherein the first portion is disposed over the first gate electrode.
›4.↳ 1The solid-state image pickup apparatus according to claim 1 , wherein the first portion is disposed over the first gate electrode, and wherein the fir…d2
The solid-state image pickup apparatus according to claim 1 , wherein the first portion is disposed over the first gate electrode, and wherein the first portion overlaps an edge of the first gate electrode at a side of the photoelectric conversion unit in a planer view.
›5.↳ 1The solid-state image pickup apparatus according to claim 1 , wherein the metal film is formed of tungsten.d2
The solid-state image pickup apparatus according to claim 1 , wherein the metal film is formed of tungsten.
›7.↳ 1The solid-state image pickup apparatus according to claim 1 , wherein the metal film has an upper face, the upper face being substantially flat.d2+2
The solid-state image pickup apparatus according to claim 1 , wherein the metal film has an upper face, the upper face being substantially flat.
›18.↳ 7The solid-state image pickup apparatus according to claim 7 , wherein the first gate electrode extends over the charge storage unit.d3
The solid-state image pickup apparatus according to claim 7 , wherein the first gate electrode extends over the charge storage unit.
›19.↳ 7The solid-state image pickup apparatus according to claim 7 , wherein the first gate electrode has a first part disposed on the charge storage unit an…d3
The solid-state image pickup apparatus according to claim 7 , wherein the first gate electrode has a first part disposed on the charge storage unit and a second part not disposed on the charge storage unit.
›8.↳ 1The solid-state image pickup apparatus according to claim 1 , further comprising an element isolation region, wherein the metal film covers a part of …d2
The solid-state image pickup apparatus according to claim 1 , further comprising an element isolation region, wherein the metal film covers a part of the element isolation region.
›10.↳ 1The solid-state image pickup apparatus according to claim 1 , wherein the first gate electrode covers approximately over a whole area of the charge st…d2
The solid-state image pickup apparatus according to claim 1 , wherein the first gate electrode covers approximately over a whole area of the charge storage unit.
›12.↳ 1The solid-state image pickup apparatus according to claim 1 , wherein the first gate electrode is disposed on the photoelectric conversion unit.d2
The solid-state image pickup apparatus according to claim 1 , wherein the first gate electrode is disposed on the photoelectric conversion unit.
›13.↳ 1The solid-state image pickup apparatus according to claim 1 , wherein the first portion is disposed on the second gate electrode.d2
The solid-state image pickup apparatus according to claim 1 , wherein the first portion is disposed on the second gate electrode.
›14.↳ 1The solid-state image pickup apparatus according to claim 1 , wherein the first portion overlaps an edge of the first gate electrode at a side of the …d2
The solid-state image pickup apparatus according to claim 1 , wherein the first portion overlaps an edge of the first gate electrode at a side of the charge storage unit.
›15.↳ 1The solid-state image pickup apparatus according to claim 1 , wherein the second portion extends from the first portion toward a surface of the semico…d2
The solid-state image pickup apparatus according to claim 1 , wherein the second portion extends from the first portion toward a surface of the semiconductor substrate.
›16.↳ 1The solid-state image pickup apparatus according to claim 1 , wherein the first portion is disposed over the charge storage unit.d2
The solid-state image pickup apparatus according to claim 1 , wherein the first portion is disposed over the charge storage unit.
›17.↳ 1The solid-state image pickup apparatus according to claim 1 , wherein the first portion is disposed over the photoelectric conversion unit.d2
The solid-state image pickup apparatus according to claim 1 , wherein the first portion is disposed over the photoelectric conversion unit.
›20.↳ 1The solid-state image pickup apparatus according to claim 1 , wherein a bottom surface of the second portion is located closer to a surface of the sem…d2
The solid-state image pickup apparatus according to claim 1 , wherein a bottom surface of the second portion is located closer to a surface of the semiconductor substrate than a bottom surface of the first portion.
›24.↳ 1An image pickup system comprising: the solid-state image pickup apparatus according to claim 1 , and a processing unit that processes a signal output …d2
An image pickup system comprising: the solid-state image pickup apparatus according to claim 1 , and a processing unit that processes a signal output from the solid-state image pickup apparatus.
