Antireflection member and orienter apparatus having a third plate part with a second notch part and an antireflection surface

This application is based upon and claims the benefit of priority from Japanese Patent Application No. 2015-207445, filed on Oct. 21, 2015; the entire contents of which are incorporated herein by reference.

Embodiments described herein relate generally to an antireflection member and an orienter apparatus.

To adjust the orientation of a substrate, an orienter apparatus irradiates an outer peripheral part of the substrate with light emitted by a light-emitting element while rotating the substrate and obtains the outer peripheral position of a notch of the substrate based on a quantity of light received by a light-receiving element. At this time, the light emitted by the light-emitting element is desired to be appropriately received by the light-receiving element.

FIG. 1 is a plan view illustrating a configuration of an ion implanting apparatus to which an orienter apparatus including an antireflection member according to an embodiment is applied;

FIG. 2 is a plan view illustrating a configuration of a vacuum transporting unit having the orienter apparatus including the antireflection member according to the embodiment arranged therein;

FIGS. 3A and 3B are a side view and a plan view illustrating a configuration of the orienter apparatus including the antireflection member according to the embodiment;

FIG. 4 is a perspective view illustrating a configuration of the antireflection member according to the embodiment;

FIGS. 5A, 5B, and 5C are exploded plan views illustrating the configuration of the antireflection member according to the embodiment;

FIGS. 6A and 6B are perspective views illustrating a mounted state of the antireflection member according to the embodiment to an apparatus body;

FIG. 7 is a diagram illustrating spectral reflection characteristics of materials according to the embodiment;

FIG. 8 is a side view illustrating a function of the antireflection member according to the embodiment;

FIG. 9 is a waveform chart illustrating an operation of the orienter apparatus including the antireflection member according to the embodiment;

FIG. 10 is a perspective view illustrating a configuration of an antireflection member according to a modification of the embodiment;

FIG. 11 is a perspective view illustrating a configuration of an antireflection member according to another modification of the embodiment;

FIG. 12 is a front view illustrating a function of the antireflection member according to the another modification of the embodiment;

FIG. 13 is a front view illustrating the function of the antireflection member according to the another modification of the embodiment; and

FIG. 14 is a waveform chart illustrating an operation of an orienter apparatus not including an antireflection member.

In general, according to one embodiment, there is provided an antireflection member including a first plate part, a second plate part, and a third plate part. The first plate part has a first end and a second end. The second end is arranged at a side opposite to the first end. The second plate part extends from a vicinity of the first end. A first notch part is arranged on the second plate part. The second plate part has an antireflection surface. The third plate part extends from a vicinity of the second end to be opposed to the second plate part. A second notch part is arranged at a position corresponding to the first notch part on the third plate part. The third plate part has an antireflection surface directed to the antireflection surface of the second plate part.

Exemplary embodiments of an antireflection member will be explained below in detail with reference to the accompanying drawings. The present invention is not limited to the following embodiments.

An orienter apparatus including an antireflection member according to an embodiment is described. In a process of manufacturing a device (for example, a semiconductor device) by processing a substrate (for example, a semiconductor substrate), the orientation of the substrate to be processed is required to be appropriate in some cases. An orienter apparatus that adjusts the orientation of the substrate may be applied to an apparatus for processing substrates in response to the above requirement.

For example, an orienter apparatus 100 is applied to an ion implanting apparatus 200 illustrated in FIG. 1 . FIG. 1 is a plan view illustrating a configuration of the ion implanting apparatus 200 . A substrate is imported to a platen implanting system 207 via an air transporting unit 209 and a vacuum transporting unit 208 . The orienter apparatus 100 is included in the vacuum transporting unit 208 .

As illustrated in FIG. 2 , a transporting apparatus imports a substrate into either a load lock chamber 209 a or 209 b in the air transporting unit 209 . FIG. 2 is a plan view illustrating a configuration of the vacuum transporting unit 208 having the orienter apparatus 100 arranged therein and an enlarged plan view of an area surrounded by the one-dot chain line in FIG. 1 . For example, when a substrate is imported into the load rock chamber 209 a , the load rock chamber 209 a is evacuated and is made to communicate with the vacuum transporting unit 208 . As indicated by the one-dot chain line arrow, an arm 208 a in the vacuum transporting unit 208 imports the substrate from the load lock chamber 209 a into the orienter apparatus 100 . The orienter apparatus 100 adjusts the orientation of the imported substrate. As indicated by the one-dot chain line arrow, an arm 208 b in the vacuum transporting unit 208 imports the substrate the orientation of which has been adjusted from the orienter apparatus 100 onto a stage 207 a of the platen implanting system 207 .

Referring back to FIG. 1 , an ion source 202 generates plasma from material gas from a gas box 201 to generate ions. An extracting system 203 includes an extracting electrode, extracts the ions from the ion source 202 with the extracting electrode and causes the ions to enter a beam accelerating system 210 . The beam accelerating system 210 includes a mass analyzer 204 , a beam contracting system 205 , and a mass-analyzing and beam-parallelizing device 206 . The mass analyzer 204 passes ions having a predetermined mass among the incident ions selectively to the beam contracting system 205 . The beam contracting system 205 accelerates the ions and contracts the ion beams to guide the ion beams to the mass-analyzing and beam-parallelizing device 206 . The mass-analyzing and beam-parallelizing device 206 selects ions having a predetermined mass from among the guided ions. Also, the mass-analyzing and beam-parallelizing device 206 adjusts and parallelizes the ion beams and guides the parallelized beams to the platen implanting system 207 . The ions having been guided to the platen implanting system 207 are implanted to a substrate.

After ion implantation is completed, the arm 208 a in the vacuum transporting unit 208 exports the substrate from the stage 207 a of the platen implanting system 207 into the load rock chamber 209 a as indicated by the one-dot chain line arrow in FIG. 2 , for example. Thereafter, the load rock chamber 209 a is released to the air and the substrate is exported to outside of the ion implanting apparatus 200 by the transporting apparatus.

In the ion implanting apparatus 200 , the platen implanting system 207 implants ions to a substrate after the orienter apparatus 100 adjusts the orientation of the substrate. Accordingly, the ions can be implanted at an appropriate angle relative to the crystal orientation of the substrate. For example, as illustrated in FIG. 3A , the orienter apparatus 100 includes an apparatus body 110 , a light-emitting element 120 , a light-receiving element 130 , a supporting mechanism 140 , and a controller 150 . FIGS. 3A and 3B illustrate a configuration of the orienter apparatus 100 including an antireflection member 10 . FIG. 3A is a side view of the orienter apparatus 100 . FIG. 3B is a plan view illustrating a part of the orienter apparatus 100 . In FIG. 3A , a Z direction represents a direction that is substantially perpendicular to the surface of a substrate WF when the substrate WF is placed in the orienter apparatus 100 and X and Y directions respectively represent two directions that are orthogonal to each other in a plane substantially perpendicular to the Z direction.

The apparatus body 110 includes parts 110 a , 110 b , 110 c , and 110 d . The part 110 a (first part) extends in the Z direction in a plate shape (see FIGS. 6A and 6B ). A principal surface 110 a 1 of the part 110 a is along the YZ plane. The part 110 b (second part) extends in the +X direction in a plate shape from the vicinity (first region) of the +Z-side end of the part 110 a . A lower surface 110 b 1 of the part 110 b is along the XY plane and extends in a direction substantially perpendicular to the principal surface 110 a 1 of the part 110 a . The part 110 c (third part) extends in a substantially horizontal direction in a plate shape from a position (second region) between the upper and lower ends of the part 110 a . An upper surface 110 c 1 of the part 110 c is along the XY plane and extends in a direction substantially perpendicular to the principal surface 110 a 1 of the part 110 a . The part 110 c extends so as to be opposed to the part 110 b . The parts 110 a , 110 b , and 110 c form a substantially F-shape as viewed from the −Y direction. The part 110 d is provided as a top plate above the substantially F-shape formed of the parts 110 a , 110 b , and 110 c . In the apparatus body 110 , the part 110 b is formed of a material composed of plastic as a main component, for example, and the parts 110 a and 110 c are formed of a material composed of metal such as aluminum, as a main component, for example. Accordingly, the surfaces of all of the parts 110 a to 110 c easily reflect light.

The light-emitting element 120 is fixed at a position opposed to the light-receiving element 130 in the apparatus body 110 . The light-emitting element 120 is arranged on the upper surface 110 c 1 of the part 110 c . For example, the light-emitting element 120 is embedded in the part 110 c in such a way that the height of the upper surface of the light-emitting element 120 is substantially equal to the height of the upper surface 110 c 1 of the part 110 c (see FIG. 6 ). Accordingly, light emitted by the light-emitting element 120 can advance along the +Z direction. For example, the light-emitting element 120 includes a lamp or an LED (Light Emitting Diode). The light emitted by the light-emitting element 120 may be infrared light or may be visible light. Turing on and off of the light-emitting element 120 may be controlled by the controller 150 .

The light-receiving element 130 is fixed at a position opposed to the light-emitting element 120 in the apparatus body 110 . The light-receiving element 130 is arranged on the lower surface 110 b 1 of the part 110 b . For example, the light-receiving element 130 projects from the part 110 b in such a way that the lower surface of the light-receiving element 130 is located lower than the lower surface 110 b 1 of the part 110 b . For example, the light-receiving element 130 includes an optical sensor. The light-receiving element 130 can receive light (for example, infrared light or visible light) that has been generated by the light-emitting element 120 and has advanced along the +Z direction and detect the intensity of the light because the light-receiving element 130 is opposed to the light-emitting element 120 . The light-receiving element 130 supplies the detected light intensity to the controller 150 .

The supporting mechanism 140 supports the substrate WF rotatably while the end of the substrate WF is positioned between the light-emitting element 120 and the light-receiving element 130 . The supporting mechanism 140 includes a pad 141 , a shaft 142 , a rotating mechanism 143 , and a lifting mechanism 144 . The substrate WF is placed on the pad 141 .

For example, as illustrated in FIG. 3B , the supporting mechanism 140 supports the substrate WF in such a way that the substantial center of the substrate WF contacts with the upper side of the pad 141 . At this time, as illustrated in FIG. 3B , the end of the substrate WF may be positioned in a region DR in which the light-emitting element 120 and the light-receiving element 130 overlap with each other as viewed through from the +Z direction.

The shaft 142 connects the pad 141 and the rotating mechanism 143 and the lifting mechanism 144 mechanically. The rotating mechanism 143 rotates the substrate WF around the axis in the Z direction via the shaft 142 and the pad 141 under the control of the controller 150 . The lifting mechanism 144 moves the substrate WF vertically in the Z direction via the shaft 142 and the pad 141 under the control of the controller 150 .

The controller 150 obtains the outer peripheral position of a notch N of the substrate WF based on a quantity of light emitted by the light-emitting element 120 and received by the light-receiving element 130 while the supporting mechanism 140 is rotating the substrate WF. That is, as illustrated in FIG. 3B , the region DR in which the light-emitting element 120 and the light-receiving element 130 overlaps with each other as viewed through from the +Z direction forms a region for detecting the outer peripheral position of the notch N of the substrate WF. For example, when the received light quantity by the light-receiving element 130 abruptly changes (increases or decreases) during the rotation of the substrate WF, the controller 150 can specify an outer peripheral position at which the abrupt change occurs as the outer peripheral position of the notch N.

For example, as illustrated in FIG. 14 , when the received light quantity abruptly changes at a plurality of positions P 1 , EP 11 to EP 17 in the outer peripheral position in one rotation of the substrate WF, specifying the outer peripheral position of the notch N is difficult for the controller 150 . That is, the controller 150 may detect not only the appropriate position P 1 of the notch N as the outer peripheral position of the notch N but also the positions EP 1 to EP 17 erroneously as the outer peripheral position of the notch N. In this way, the notch N is detected at the plurality of positions P 1 , EP 11 to EP 17 . Accordingly, a notch detection error is likely to occur.

This error is likely to occur in the latter half of an ion implanting process among all processes for processing the substrate WF, and thus it has been found that the error is an error caused by the substrate WF. When a factor of the error is examined in more detail, it has been found that erroneous detection occurs because not a stain or the like on the end of the substrate WF but the pattern or the oxide film on the front and rear surfaces of the substrate WF causes irregular reflection of light (for example, infrared light) and the light-receiving element 130 receives the irregularly reflected light.

Therefore, in the present embodiment, the antireflection member 10 is arranged in a region including the vicinity of the light-emitting element 120 and the vicinity of the light-receiving element 130 in the apparatus body 110 . Accordingly, while cost of the orienter apparatus 100 can be suppressed, irregular reflection of light emitted by the light-emitting element 120 can be suppressed from having influence on the substrate WF.

Specifically, the antireflection member 10 to be arranged in the apparatus body 110 is configured as illustrated in FIGS. 4 and 5A-5C . FIG. 4 is a perspective view illustrating a configuration of the antireflection member 10 . FIGS. 5A, 5B, and 5C are exploded plan views illustrating the configuration of the antireflection member. In FIGS. 4 and 5A-5C , the X, Y, and Z directions are illustrated so as to match directions when the antireflection member 10 is arranged in the apparatus body 110 .

The antireflection member 10 includes a plate part (first plate part) 1 , a plate part (second plate part) 2 , and a plate part (third plate part) 3 . The plate part 1 is arranged so as to be upright along the Z direction and extends in the Y direction in a plate shape. As illustrated in FIG. 5B , the plate part 1 includes ends 1 a , 1 b , 1 c , and 1 d and an antireflection surface 1 e . The ends 1 a , 1 b , 1 c , and 1 d are ends at the +Z side, the −Z side, the −Y side, and the +Y side of the plate part 1 , respectively. The antireflection surface 1 e is along the YZ plane. The antireflection surface 1 e is a principal surface including an antireflection function of the plate part 1 . The antireflection surface 1 e is a principal surface directed to the +X direction and directed to the plate parts 2 and 3 (see FIG. 3A ).

As illustrated in FIGS. 6A and 6B , the plate part 1 is arranged in a region (that is, a third region between the first region and the second region) in the principle surface 110 a 1 (see FIG. 3A ) of the part 110 a between the part 110 b and the part 110 c in the apparatus body 110 . FIGS. 6A and 6B are perspective views illustrating a mounted state of the antireflection member 10 to the apparatus body 110 . For example, the plate part 1 may be fixed in the region in the principle surface 110 a 1 between the part 110 b and the part 110 c with an adhesive or the like. That is, the plate part 1 functions as a shielding plate for shielding re-reflection of light that has been generated by the light-emitting element 120 and irregularly reflected by the front or rear surface of the substrate WF.

As illustrated in FIGS. 4 and 5 , the plate part 2 extends from the vicinity of the end 1 a of the plate part 1 in the +X direction in a plate shape. As illustrated in FIG. 5A , the plate part 2 includes ends 2 a , 2 b , 2 c , and 2 d , an antireflection surface 2 e (see FIG. 6A ), and a notch part (first notch part) 2 f . The ends 2 a , 2 b , 2 c , and 2 d are ends at the −X side, the +X side, the −Y side, and the +Y side of the plate part 2 , respectively. The end 2 b is an end of the plate part 2 opposed to the plate part 1 . The antireflection surface 2 e is along the XY plane. The antireflection surface 2 e is a principal surface including an antireflection function of the plate part 2 . The antireflection surface 2 e is a principal surface directed to the −Z direction and directed to an antireflection surface 3 e of the plate part 3 (see FIG. 3A ). The notch part 2 f extends from the end 2 b so as to approach the plate part 1 .

As illustrated in FIG. 6A , the plate part 2 is arranged in the vicinity of the light-receiving element 130 in the apparatus body 110 . The plate part 2 is arranged on the lower surface 110 b 1 (see FIG. 3A ) of the part 110 b . For example, the plate part 2 may be fixed to the lower surface 110 b 1 of the part 110 b with an adhesive or the like. The notch part 2 f is formed at a position corresponding to the light-receiving element 130 on the plate part 2 . The notch part 2 f has a shape (a shape extending in the X direction) corresponding to the light-receiving element 130 . That is, the plate part 2 functions as a shielding plate for shielding re-reflection of light that has been generated by the light-emitting element 120 and irregularly reflected by the front or rear surface of the substrate WF.

As illustrated in FIGS. 4 and 5 , the plate part 3 extends from the vicinity of the end 1 b of the plate part 1 in the +X direction in a plate shape. As illustrated in FIG. 5C , the plate part 3 includes ends 3 a , 3 b , 3 c , and 3 d , the antireflection surface 3 e , and a notch part (second notch part) 3 f . The ends 3 a , 3 b , 3 c , and 3 d are ends at the −X side, the +X side, the −Y side, and the +Y side of the plate part 3 , respectively. The end 3 b is an end of the plate part 3 opposed to the plate part 1 . The antireflection surface 3 e is along the XY plane. The antireflection surface 3 e is a principal surface including an antireflection function of the plate part 3 . The antireflection surface 3 e is a principal surface directed to the +Z direction and directed to the antireflection surface 2 e of the plate part 2 (see FIG. 3A ). The notch part 3 f extends from the end 3 b so as to approach the plate part 1 .

As illustrated in FIG. 6B , the plate part 3 is arranged in the vicinity of the light-emitting element 120 in the apparatus body 110 . The plate part 3 is arranged on the upper surface 110 c 1 (see FIG. 3A ) of the part 110 c . For example, the plate part 3 may be fixed to the upper surface 110 c 1 of the part 110 c with an adhesive or the like. The notch part 3 f is formed at a position corresponding to the light-emitting element 120 on the plate part 3 . The notch part 3 f has a shape (a shape extending in the X direction) corresponding to the light-emitting element 120 . That is, the plate part 3 functions as a shielding plate for shielding re-reflection of light that has been generated by the light-emitting element 120 and irregularly reflected by the front or rear surface of the substrate WF.

Each of the antireflection surfaces 1 e , 2 e , and 3 e includes a surface having a lower reflectance against light emitted by the light-emitting element 120 than a predetermined reflectance (for example, 10%). It should be noted that it suffices that the surface having a lower reflectance than a predetermined reflectance is included at least in each of the antireflection surfaces 1 e , 2 e , and 3 e of the plate parts 1 , 2 , and 3 , respectively. For example, the surface having the lower reflectance may be included in all the surfaces of the plate parts 1 , 2 , and 3 .

Considering that the orienter apparatus 100 including the antireflection member 10 is used in a vacuum state (see FIGS. 1 and 2 ), each of the antireflection surfaces 1 e , 2 e , and 3 e can include a surface suitable for use in the vacuum state. For example, when light emitted by the light-emitting element 120 is infrared light, a surface plated with nickel for blackening and a surface applied with black paint respectively have a lower reflectance than a predetermined reflectance (for example, 10%) in an infrared region IRR, as illustrated in FIG. 7 . Consequently, these surfaces are suitable as surfaces to be included in the antireflection surfaces 1 e , 2 e , and 3 e . FIG. 7 is a diagram illustrating spectral reflection characteristics of materials. That is, when light emitted by the light-emitting element 120 is infrared light, each of the antireflection surfaces 1 e , 2 e , and 3 e includes at least one of a surface plated with nickel for blackening and a surface applied with black paint.

The antireflection surfaces 1 e , 2 e , and 3 e respectively including a surface plated with nickel for blackening can be formed by applying first nickel plating or second nickel plating for blackening to principal surfaces to become the antireflection surfaces 1 e , 2 e , and 3 e of the plate parts 1 , 2 , and 3 , respectively. For example, surfaces having undergone the first nickel plating for blackening can be formed by applying electroless nickel plating to the principal surfaces to become the antireflection surfaces 1 e , 2 e , and 3 e of the plate parts 1 , 2 , and 3 , using an alkaline electroless-nickel-plating liquid containing phosphinic acid and citric acid. Alternatively, for example, surfaces having undergone the second nickel plating for blackening can be formed by applying electroless nickel plating to the principal surfaces to become the antireflection surfaces 1 e , 2 e , and 3 e of the plate parts 1 , 2 , and 3 , using a plating liquid that is obtained by adding sulfur compounds having a thiol group and heavy metal-stabilizing agents to an alkaline electroless-nickel-plating liquid containing phosphinic acid and citric acid.

The antireflection surfaces 1 e , 2 e , and 3 e respectively including a surface applied with black paint can be formed by applying the principal surfaces to become the antireflection surfaces 1 e , 2 e , and 3 e of the plate parts 1 , 2 , and 3 with first black paint, second black paint, or third black paint by a spray or the like. The first black paint is mainly composed of black carbon. The second black paint differs from the first black paint and has a lower spectral reflectance in the infrared region IRR than that of the first black paint. The third black paint differs from the first black paint and the second black paint and has a lower spectral reflectance in the infrared region IRR than those of the first black paint and the second black paint.

It should be noted that, when light emitted by the light-emitting element 120 is infrared light, the reflectance of a surface treated with alumite is equal to or larger than a predetermined reflectance (for example, 10%) in the infrared region IRR. Accordingly, the surface treated with alumite is inappropriate as a surface to be included in the antireflection surface 1 e , 2 e , or 3 e . Meanwhile, for example, when light emitted by the light-emitting element 120 is visible light, the reflectance of a surface treated with alumite is lower than a predetermined reflectance (for example, 10%) in a visible light region VLR. Accordingly, the surface treated with alumite is appropriate as a surface to be included in the antireflection surface 1 e , 2 e , or 3 e . That is, when light emitted by the light-emitting element 120 is visible light, each of the antireflection surfaces 1 e , 2 e , and 3 e includes at least one of a surface treated with alumite, a surface plated with nickel for blackening, and a surface applied with black paint. When the plate parts 1 , 2 , and 3 are formed of a material composed of aluminum as a main component, the antireflection surfaces 1 e , 2 e , and 3 e respectively including a surface treated with alumite can be formed by applying alumite treatment (oxidation treatment) to the principal surfaces to become the antireflection surfaces 1 e , 2 e , and 3 e of the plate parts 1 , 2 , and 3 .

In the orienter apparatus 100 including the antireflection member 10 , when light emitted by the light-emitting element 120 is received by the light-receiving element 130 while the supporting mechanism 140 is rotating the substrate WF, the antireflection member 10 can prevent irregular reflection of the light, as illustrated in FIG. 8 . FIG. 8 is a side view illustrating a function of the antireflection member 10 . For example, when light emitted by the light-emitting element 120 is reflected by a rear surface WFb of the substrate WF, re-reflection of the reflected light can be suppressed by the antireflection surface 1 e . When light that the antireflection surface 1 e has failed to suppress enters the antireflection surface 2 e or 3 e , re-reflection of the light can be suppressed by the antireflection surface 2 e or 3 e . Further, when light that the antireflection surface 2 e or 3 e has failed to suppress is reflected by a front surface WFa of the substrate WF and enters the antireflection surface 2 e or 3 e again, re-reflection of the light can be suppressed by the antireflection surface 2 e or 3 e . Therefore, abrupt change in the received light quantity by the light-receiving element 130 due to irregular light reflection during the rotation of the substrate WF can be suppressed.

For example, as illustrated in FIG. 9 , the controller 150 can obtain the outer peripheral position of the notch N of the substrate WE appropriately based on the quantity of light emitted by the light-emitting element 120 and received by the light-receiving element 130 while the supporting mechanism 140 is rotating the substrate WF. FIG. 9 is a waveform chart illustrating an operation of the orienter apparatus 100 . For example, as illustrated in FIG. 9 , the received light quantity abruptly changes at one position P 1 ′ in the outer peripheral position in one rotation of the substrate WF. The controller 150 can specify the outer peripheral position of the notch N as the position P 1 ′. That is, occurrence of notch detection errors can be prevented.

It should be noted that the background-like waviness in the received light quantity by the light-receiving element 130 is illustrated in FIG. 9 . This waviness is caused by the influence of the slight deviation of the placement position of the substrate WF on the pad 141 from the center of the substrate WF, as illustrated in FIG. 3B . Even in this case, the controller 150 can determine the position P 1 ′ at which the received light quantity abruptly changes as the outer peripheral position of the notch N.

As described above, in the present embodiment, the antireflection member 10 is arranged in the region including the vicinity of the light-emitting element 120 and the vicinity of the light-receiving element 130 in the apparatus body 110 in the orienter apparatus 100 . Accordingly, abrupt change in the received light quantity by the light-receiving element 130 due to irregular light reflection during the rotation of the substrate WE can be suppressed and the light-receiving element 130 is allowed to receive light emitted by the light-emitting element 120 appropriately. As a result, noise components due to irregular light reflection can be reduced in the received light quantity by the light-receiving element 130 and occurrence of notch detection errors can be suppressed while cost of the orienter apparatus 100 can be suppressed without greatly changing the configuration of the apparatus body 110 .

In the present embodiment, in the antireflection member 10 , the plate part 2 to be arranged in the vicinity of the light-emitting element 120 and the plate part 3 to be arranged in the vicinity of the light-receiving element 130 have the antireflection surfaces 2 e and 3 e opposed to each other, respectively. The plate part 1 has the antireflection surface 1 e directed to the plate parts 2 and 3 . The notch parts 2 f and 3 f are arranged in the plate parts 2 and 3 so as to correspond to the positions of the light-emitting element 120 and the light-receiving element 130 , respectively. Accordingly, the antireflection member 10 does not shield light emitted by the light-emitting element 120 to be received by the light-receiving element 130 . Therefore, it is possible to provide the antireflection member 10 that is suitable to cause the light-receiving element 130 to receive appropriately light emitted by the light-emitting element 120 in the orienter apparatus 100 .

It should be noted that, although FIGS. 1 and 2 exemplify a case where the orienter apparatus 100 is applied to the ion implanting apparatus 200 , the orienter apparatus 100 may be applied to other apparatuses configured to adjust the orientation of the substrate WF.

FIGS. 10 to 13 illustrate the configurations of antireflection members according to modifications of the embodiment. As illustrated in FIG. 10 , an antireflection member 10 i may be fixed to the apparatus body 110 via a screw instead of an adhesive. FIG. 10 is a perspective view illustrating the configuration of the antireflection member 10 i . For example, the antireflection member 10 i further includes plate parts 4 i and 5 i . The plate part 4 i extends from the end 1 c of the plate part 1 in the −X direction in a plate shape and extends from the end 1 c of the plate part 1 to a side opposite to the plate parts 2 and 3 . The plate part 4 i has a shape such that the Z direction is its longitudinal direction. The plate part 4 i has screw holes 4 e and 4 f corresponding to screw holes of the apparatus body 110 . Similarly, the plate part 5 i extends from the end 1 d of the plate part 1 in the −X direction in a plate shape and extends from the end 1 d of the plate part 1 to a side opposite to the plate parts 2 and 3 . The plate part 5 i has a shape such that the Z direction is its longitudinal direction. The plate part 5 i has screw holes 5 e and 5 f corresponding to screw holes 110 e and 110 f (see FIG. 3A ) of the apparatus body 110 , respectively. This configuration allows the antireflection member 10 i to be fixed to via screws or removed from the apparatus body 110 . Consequently, the maintenance or replacement of the antireflection member 10 i can be performed easily.

Alternatively, as illustrated in FIG. 11 , an antireflection member 10 j may further has a shape with angles relative to the light-emitting element 120 and the light-receiving element 130 . FIG. 11 is a perspective view illustrating a configuration of the antireflection member 10 j.

For example, in a plate part 2 j , the notch part 2 f is arranged closer to a plate part 3 j than principal parts 2 g of the plate part 2 j (see FIG. 12 ). The plate part 2 j further includes inclined parts 2 h . The inclined parts 2 h are inclined in respective directions from the principal parts 2 g toward the plate part 3 j and extend to the notch part 2 f . Consequently, oblique light due to irregular reflection that is indicated by broken-line arrows in FIG. 12 , among light that advances toward the light-receiving element 130 , can be suppressed from being received by the light-receiving element 130 . Therefore, appropriate light that is indicated by solid-line arrows in FIG. 12 can be selectively received by the light-receiving element 130 . FIG. 12 is a front view illustrating a function of the antireflection member 10 j . As a result, noise components due to irregular light reflection can be further reduced in the received light quantity by the light-receiving element 130 .

In the plate part 3 j , the notch part 3 f is arranged closer to the plate part 2 j than principal parts 3 g of the plate part 3 j (see FIG. 13 ). The plate part 3 j further includes inclined parts 3 h and folded-back parts 3 k . The inclined parts 3 h are inclined in respective directions from the principal parts 3 g toward the plate part 2 j and extend to the notch part 3 f . The folded-back parts 3 k are folded at the respective ends of the inclined parts 3 h at the notch part 3 f side toward the side opposite to the plate part 2 j . Consequently, oblique light that is indicated by broken-line arrows in FIG. 13 and easily becomes a factor of irregular reflection, among light that is emitted by the light-emitting element 120 , can be suppressed from being emitted by the light-emitting element 120 . Therefore, appropriate light that is indicated by solid-line arrows in FIG. 13 can be selectively emitted by the light-emitting element 120 . FIG. 13 is a front view illustrating a function of the antireflection member 10 j . As a result, noise components due to irregular light reflection can be further reduced in the received light quantity by the light-receiving element 130 .

Alternatively, although FIG. 11 illustrates a case where the antireflection member 10 j has a shape with angles in the vicinities of both the light-emitting element 120 and the light-receiving element 130 , the antireflection member 10 j may have a shape with an angle in the vicinity of either the light-emitting element 120 or the light-receiving element 130 . Even when the antireflection member 10 j has such a shape, noise components due to irregular light reflection can be further reduced in the received light quantity by the light-receiving element 130 , compared with a case where each of the plate parts 2 and 3 has a flat plate shape as a whole.

In the above embodiment, there has been described an example in which the light-emitting element 120 and the light-receiving element 130 are arranged in the apparatus body 110 so as to cause the detection light of the notch N to advance along the +Z direction. However, the position of the light-emitting element 120 and the position of the light-receiving element 130 may be interchanged in the apparatus body 110 so as to cause the detection light of the notch N to advance along the −Z direction.

While certain embodiments have been described, these embodiments have been presented by way of example only, and are not intended to limit the scope of the inventions. Indeed, the novel embodiments described herein may be embodied in a variety of other forms; furthermore, various omissions, substitutions and changes in the form of the embodiments described herein may be made without departing from the spirit of the inventions. The accompanying claims and their equivalents are intended to cover such forms or modifications as would fall within the scope and spirit of the inventions.