An air-cooling heat dissipation device for removing heat from an electronic component, the air-cooling heat dissipation device comprising: a supporting substrate comprising a top surface, a bottom surface, an introduction opening and a thermal conduction plate, wherein the thermal conduction plate is disposed on the top surface of the supporting substrate and aligned with the introduction opening, and the electronic component is disposed on the thermal conduction plate; an air pump, wherein the air pump is a piezoelectric air pump fixed on the bottom surface of the supporting substrate, and correspondingly sealing the introduction opening, wherein the air pump comprises: a resonance plate having a central aperture; a piezoelectric actuator aligned with the resonance plate; and a covering member having a sidewall, a bottom plate and an opening, wherein the bottom surface of the supporting substrate continuously extends from one side of the sidewall to the other side of the sidewall, and the sidewall is protruding from the edge of the bottom plate to contact the bottom surface of the supporting substrate, wherein an accommodation space is defined by the bottom plate and the sidewall collaboratively, the resonance plate and the piezoelectric actuator are disposed within the accommodation space, and the opening is formed on the sidewall, wherein a first chamber is formed between the resonance plate and the bottom plate of covering member, and a convergence chamber is defined by the resonance plate and the sidewall of the covering member collaboratively; and a heat sink attached on the electronic component, wherein when the piezoelectric actuator is enabled to perform a gas-collection operation, a gas is introduced into the air pump through the opening of the covering member and converged to the convergence chamber, and then the gas is transferred to the first chamber through the central aperture of the resonance plate and temporarily stored in the first chamber, wherein when the piezoelectric actuator is enabled to perform a gas-releasing operation, the gas flows from the first chamber through the central aperture of the resonance plate and to the introduction opening, so as to exchange heat with the thermal conduction plate.
›2.↳ 1The air-cooling heat dissipation device according to claim 1 , wherein the introduction opening runs through the top surface and the bottom surface of…d2
The air-cooling heat dissipation device according to claim 1 , wherein the introduction opening runs through the top surface and the bottom surface of the supporting substrate.
›3.↳ 1The air-cooling heat dissipation device according to claim 1 , wherein a gap is formed between the thermal conduction plate and the supporting substra…d2
The air-cooling heat dissipation device according to claim 1 , wherein a gap is formed between the thermal conduction plate and the supporting substrate for allowing the gas to go through.
›4.↳ 1The air-cooling heat dissipation device according to claim 1 , wherein the thermal conduction plate is attached on a first surface of the electronic c…d2
The air-cooling heat dissipation device according to claim 1 , wherein the thermal conduction plate is attached on a first surface of the electronic component, and the heat sink is attached on a second surface of the electronic component.
›5.↳ 1The air-cooling heat dissipation device according to claim 1 , wherein the supporting substrate further comprises at least one circulating groove runn…d2
The air-cooling heat dissipation device according to claim 1 , wherein the supporting substrate further comprises at least one circulating groove running through the top surface and the bottom surface of the supporting substrate, and the at least one circulating groove is adjacent to the periphery of the thermal conduction plate.
›6.↳ 1The air-cooling heat dissipation device according to claim 1 , wherein the piezoelectric actuator comprises: a suspension plate having a first surface…d2+5
The air-cooling heat dissipation device according to claim 1 , wherein the piezoelectric actuator comprises: a suspension plate having a first surface and an opposing second surface; an outer frame having at least one bracket arranged between the suspension plate and the outer frame and connected therebetween; and a piezoelectric ceramic plate attached on the first surface of the suspension plate driving curvy vibration of the suspension plate when being applied to a voltage.
›7.↳ 6The air-cooling heat dissipation device according to claim 6 , wherein a gap is formed between the resonance plate and the piezoelectric actuator.d3+2
The air-cooling heat dissipation device according to claim 6 , wherein a gap is formed between the resonance plate and the piezoelectric actuator.
›8.↳ 7The air-cooling heat dissipation device according to claim 7 , wherein the piezoelectric air pump further comprises a conducting plate and at least on…d4+1
The air-cooling heat dissipation device according to claim 7 , wherein the piezoelectric air pump further comprises a conducting plate and at least one insulation plate, wherein the at least one insulation plate and the conducting plate are sequentially disposed beneath the bottom side of the piezoelectric actuator.
›9.↳ 8The air-cooling heat dissipation device according to claim 8 , wherein the outer frame of the piezoelectric actuator comprises a first conducting pin,…d5
The air-cooling heat dissipation device according to claim 8 , wherein the outer frame of the piezoelectric actuator comprises a first conducting pin, the conducting plate comprises a second conducting pin, and the opening of the covering member is formed on the sidewall of the covering member, wherein the first conducting pin and the second conducting pin are protruding out of the opening of the covering member so as to be electrically connected with an external power source.
›10.↳ 6The air-cooling heat dissipation device according to claim 6 , wherein at least one vacant space is formed between the suspension plate, the outer fra…d3
The air-cooling heat dissipation device according to claim 6 , wherein at least one vacant space is formed between the suspension plate, the outer frame and the at least one bracket, and two ends of the bracket are connected to the suspension plate and the outer frame, respectively.
›11.↳ 6The air-cooling heat dissipation device according to claim 6 , wherein the suspension plate has a bulge formed on the second surface thereof, and the …d3
The air-cooling heat dissipation device according to claim 6 , wherein the suspension plate has a bulge formed on the second surface thereof, and the bulge is a cylinder.
›12.↳ 1The air-cooling heat dissipation device according to claim 1 , further comprising a control system, wherein the control system comprises: a control un…d2
The air-cooling heat dissipation device according to claim 1 , further comprising a control system, wherein the control system comprises: a control unit electrically connected with the air pump for controlling operations of the air pump; and a temperature sensor electrically connected with the control unit and located near the electronic component, wherein the temperature sensor detects a temperature of the electronic component and transmits a corresponding detecting signal to the control unit, wherein the control unit obtains the temperature of the electronic component according to the detecting signal, wherein if the control unit determines the temperature of the electronic component is higher than or equal to a threshold value, the control unit enables the air pump to drive the air to flow, wherein if the control unit determines the temperature of the electronic component is lower than the threshold value, the control unit disables the air pump.
